Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Lokesh Siddhu"'
Publikováno v:
ACM Transactions on Design Automation of Electronic Systems. 26:1-31
3D memory systems offer several advantages in terms of area, bandwidth, and energy efficiency. However, thermal issues arising out of higher power densities have limited their widespread use. While prior works have looked at reducing dynamic power th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bb5c1ec505a871ded76a9d8780cb261
https://doi.org/10.1145/3419468
https://doi.org/10.1145/3419468
Publikováno v:
2022 Design, Automation & Test in Europe Conference & Exhibition (DATE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb5b7fa55168920a5ed8eea219bdb0af
https://doi.org/10.23919/date54114.2022.9774743
https://doi.org/10.23919/date54114.2022.9774743
Autor:
Lokesh Siddhu, Preeti Ranjan Panda
Publikováno v:
ACM Transactions on Embedded Computing Systems. 18:1-22
Recent research on mitigating thermal problems in 3D memories has covered reactive strategies that reduce memory power consumption, and thereby, performance, when the memory temperature reaches the maximum operating limit. Such techniques could benef
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::712378c6dc366e1ed27501a630c80423
https://doi.org/10.1145/3358208
https://doi.org/10.1145/3358208
Autor:
Lokesh Siddhu, Preeti Ranjan Panda
Publikováno v:
CSI Transactions on ICT. 5:129-134
Research in 3D integration has attracted researchers from industry as well as academia due to its benefits over 2D architecture such as better performance, lower power consumption, small form factor and support for heterogeneous technology integratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9382a4e79f65b77e85e4248b15a48335
https://doi.org/10.1007/s40012-017-0156-x
https://doi.org/10.1007/s40012-017-0156-x
Autor:
Lokesh Siddhu, Preeti Ranjan Panda
Publikováno v:
DATE
3D memory systems offer several advantages in terms of area, bandwidth, and energy efficiency. However, thermal issues arising out of higher power densities have limited their widespread use. While prior works have looked at reducing dynamic power th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::324cf9453804616b5765d3f35df90345
https://doi.org/10.23919/date.2019.8715091
https://doi.org/10.23919/date.2019.8715091
Publikováno v:
VLSI Design
Dynamic power dissipation due to redundant switching is an important metric in data-path design. This paper focuses on the use of ingenious operand isolation circuits for low power design. Operand isolation attempts to reduce switching by clamping or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62d2b5443ab8dc591e904f96909f4581
https://doi.org/10.1109/vlsid.2014.90
https://doi.org/10.1109/vlsid.2014.90