Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Lok Boon Keng"'
Autor:
Lee, Amos Wei Lun, Neo, Edward Ren Kai, Khoo, Zi-Yu, Yeo, Zhiquan, Tan, Yee Shee, Chng, Shuyun, Yan, Wenjin, Lok, Boon Keng, Low, Jonathan Sze Choong
Publikováno v:
In Resources, Conservation & Recycling July 2021 170
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59abade48f9cb5b95bbe8751d25fce8d
https://doi.org/10.1109/eptc56328.2022.10013172
https://doi.org/10.1109/eptc56328.2022.10013172
Autor:
Liang, Yen Nan, Lok, Boon Keng, Wang, Libo, Feng, Chengang, Lu, Albert Chee Wai, Mei, Ting, Hu, Xiao
Publikováno v:
In Thin Solid Films 1 October 2013 544:509-514
Akademický článek
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K zobrazení výsledku je třeba se přihlásit.
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Autor:
Qi, Xiaoying, Wu, Ruige, Lok, Boon Keng, Kerk, Wai Tat, Lai, Steve Foo Khuen, Fan, Wei, Pu, Kanyi
Publikováno v:
Small; 1/27/2022, Vol. 18 Issue 4, p1-10, 10p
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Publikováno v:
Frontiers of Mechanical Engineering; Jun2020, Vol. 15 Issue 2, p303-318, 16p
Publikováno v:
International Congress on Applications of Lasers & Electro-Optics.
The sintering of nanoparticle based inks is a key process in the manufacture of functional printed electronics on flexible and thermally sensitive substrates. The large area format in a roll to roll process has attracted the interest of both the indu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da27230272ac5b922cdb38696094be08
https://doi.org/10.2351/1.5062988
https://doi.org/10.2351/1.5062988
Publikováno v:
International Congress on Applications of Lasers & Electro-Optics.
The sintering process of nanoparticle based inks is a fundamental step in the manufacture of functional printed electronics for large-area applications on flexible substrates. This paper explores the feasibility of different laser systems to cure pri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb12ccdf7d429cf921a4e00cb147f9b7
https://doi.org/10.2351/1.5062403
https://doi.org/10.2351/1.5062403
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Silver conductive ink is widely used to form conductive electrode in printed electronics applications. However, rapid rise in silver price is driving the need for alternative conductive ink that is significantly more cost-effective [1]. Copper based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e2529fce6ba4f91eedaa9f1de330222
https://doi.org/10.1109/eptc.2011.6184426
https://doi.org/10.1109/eptc.2011.6184426