Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Lois Liao"'
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis
Autor:
Lois, Liao Jinzhi, Meng, Tian, Yong, Du, Qiang, Ji, Lei, Zhu, Xi, Zhang, Younan, Hua, Xiaomin, Li
Publikováno v:
In Microelectronics Reliability August 2022 135
Publikováno v:
International Symposium for Testing and Failure Analysis.
In wafer fabrication, silicon defects on the substrate directly affect the yield of the wafer. In this paper, we will study and discuss a chemical delayering and delineate method for silicon defects in wafer fabrication using Secco etch. It is well-k
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f653e85b6eca0883a5235671fb8b22d
https://doi.org/10.31399/asm.cp.istfa2022p0365
https://doi.org/10.31399/asm.cp.istfa2022p0365
Publikováno v:
International Symposium for Testing and Failure Analysis.
Currently, wire bonding is still the dominant interconnection mode in microelectronic packaging, and epoxy molding compound (EMC) is the major encapsulant material. Normally EMC contains chlorine (Cl) and sulfur (S) ions. It is important to understan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f21fbc0d6a03d32958a7d4bc04869f17
https://doi.org/10.31399/asm.cp.istfa2022p0374
https://doi.org/10.31399/asm.cp.istfa2022p0374
Autor:
Younan Hua, Lois Liao, Yanfei Zhao, Linhua Zhang, Tingting He, Yuanyuan Liu, Xi Zhang, Chao Fu, Xiaomin Li
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dee593ab89f98949ddb0cc1cbd16a57f
https://doi.org/10.1109/icept56209.2022.9873362
https://doi.org/10.1109/icept56209.2022.9873362
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee1cbd3d3ca62f736ae5d235c4fa3d8d
https://doi.org/10.1109/icept56209.2022.9872588
https://doi.org/10.1109/icept56209.2022.9872588
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::084196eeaba32c9b9e72dca03e2a72f3
https://doi.org/10.1109/ipfa55383.2022.9915786
https://doi.org/10.1109/ipfa55383.2022.9915786
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::122e4a357a39abaceff7fcff6d13d585
https://doi.org/10.1109/ipfa55383.2022.9915758
https://doi.org/10.1109/ipfa55383.2022.9915758
Autor:
Lois Liao
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::313239463162a1eaf24be590aeaab7f2
https://doi.org/10.2139/ssrn.4033722
https://doi.org/10.2139/ssrn.4033722
Autor:
Lois Liao, Michelle Baddeley
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a4de334d687a3bc2de288a697604b13
https://doi.org/10.2139/ssrn.4034357
https://doi.org/10.2139/ssrn.4034357
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa76140a49b1c3806637ae1a4f2105d7
https://doi.org/10.1109/eptc53413.2021.9663989
https://doi.org/10.1109/eptc53413.2021.9663989