Zobrazeno 1 - 10
of 56
pro vyhledávání: '"Loh Wei Keat"'
Akademický článek
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Autor:
Azmi, Muhammad Afiq, Abdullah, Mohd Zulkifly, Shuib, Raa Khimi, Ariff, Zulkifli Mohamad, Loh, Wei Keat, Ooi, Renn Chan, Ooi, Chun Keang, Abdullah, Muhammad Khalil
Publikováno v:
Polymer Bulletin; Feb2024, Vol. 81 Issue 3, p2385-2406, 22p
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Publikováno v:
Journal of Electronic Packaging; 20240101, Issue: Preprints p1-9, 9p
Autor:
Renn Chan Ooi, Franco Costa, Sam Hsieh, Ethan Chiu, Wendy Xu, Dave Yu, Darwin Fan, Allen Cheng, Andrew Gattuso, Yongfu Wang, Currey Hsieh, Jeffery Toran, John Thompson, Pierre-Louis Toussaint, Ryan Curry, Loh Wei Keat, Ron Kulterman, Haley Fu
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d45560bc70c9f2100c0bd99809c7ca5
https://doi.org/10.1109/eptc56328.2022.10013256
https://doi.org/10.1109/eptc56328.2022.10013256
Autor:
Loh, Wei Keat1, Haley Fu2
Publikováno v:
SMT: Surface Mount Technology. Jul2016, Vol. 31 Issue 7, p68-76. 7p.
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Reliability defect associated with thermal and humidity environment is not a new issue in modern electronics packaging. Moisture entrapment causes localized vapor pressure build up and leads to pop-corning or delamination in the internal structures w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3ef060ef18ab51befeab3cd9a29a1aa
https://doi.org/10.1109/icep-iaac.2015.7111116
https://doi.org/10.1109/icep-iaac.2015.7111116
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
PBGA (Plastic Ball Grid Array) has been around for years as the leading packaging technology for I/O controller. Occasionally PBGA package exhibits surface mount issues, typically the solder bridging, at very low defect per million. A series of inves
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71b2e688ae5393e282114f40fb4830f6
https://doi.org/10.1109/iemt.2010.5746693
https://doi.org/10.1109/iemt.2010.5746693
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ϕ of a material point in the solder/IMC interface, is expressed in terms of orthogon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4903d9e4aea436ae2207da5570cefc82
https://doi.org/10.1109/eptc.2009.5416455
https://doi.org/10.1109/eptc.2009.5416455
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
In this study, cohesive damage zone model is evaluated and employed to model solder/intermetallics (IMC) interface crack initiation and propagation in solder interconnects. Interface materials damage is quantified in terms of stress-to-strength ratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7333090dc7aa91461ab7fd50757a7983
https://doi.org/10.1109/eptc.2008.4763533
https://doi.org/10.1109/eptc.2008.4763533