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Autor:
Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In recent years, there has been a significant increase in cloud computing, networking, virtualization, and storage applications, leading to an increase in demand for high-performance servers. The increase in performance demands is currently being met
Autor:
Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower ther
Autor:
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The rising demand for high-performance central and graphical processing units has resulted in the need for more efficient thermal management techniques like direct-to-chip liquid cooling. Direct Liquid Cooling using cold plates is one of the most eff
Publikováno v:
PROCEEDINGS OF THE 14TH ASIA-PACIFIC PHYSICS CONFERENCE.
Titanium alloys are metals obtained by the homogeneous mixture of titanium and other chemical elements (metal or non-metalloids). Titanium alloy (Ti-6Al-4V) has been widely used in aerospace and medical applications and the demand is ever growing due