Zobrazeno 1 - 2
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pro vyhledávání: '"Lo-Lin Chen"'
Autor:
Lo-Lin Chen, 陳洛嶙
102
The purpose of the study is developing the selective electroplating technique. For the manufacture of semiconductor, we can successfully fabricate the copper bumps on the pre-defined pattern seed layer without using barriers by the selective
The purpose of the study is developing the selective electroplating technique. For the manufacture of semiconductor, we can successfully fabricate the copper bumps on the pre-defined pattern seed layer without using barriers by the selective
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/u4n9s9
Publikováno v:
Research on Chemical Intermediates. 40:2347-2354
We successfully fabricated a predefined patterned copper (Cu) substrate for thin GaN light-emitting diodes without barriers by the selective electroplating technique. The contours of Cu bumps fabricated using different electroplating modes and parame
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed2ded96f2389693762a2cc0c407bae3
https://doi.org/10.1007/s11164-014-1611-z
https://doi.org/10.1007/s11164-014-1611-z
