Zobrazeno 1 - 10
of 234
pro vyhledávání: '"Lixi Wan"'
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2069 (2023)
This brief proposes a 1–6 GHz broadband double-balanced mixer. On the basis of the standard Marchand balun mixer, two techniques to enhance the performance of the mixer are proposed. Firstly, by loading capacitors, the amplitude and phase imbalance
Externí odkaz:
https://doaj.org/article/6686c57176354d5ebbf5628a262d8e44
Publikováno v:
Micromachines, Vol 14, Iss 2, p 356 (2023)
This paper presents some techniques to improve the linearity of traditional resistive feedback PGAs. By utilizing the switched op-amp in the PGA, the MOS switches in the feedback resistor array can be eliminated and thus the PGA’s linearity can be
Externí odkaz:
https://doaj.org/article/ad6ea01088b44dd5999301e848eea432
Publikováno v:
Journal of Advanced Ceramics, Vol 13, Iss 10, Pp 1666-1676 (2024)
Polymer-derived ceramic (PDC)-SiOC is a highly promising microwave-absorbing material characterized by high temperature resistance, lightweight, high strength, and extremely low cost. The weak electromagnetic wave (EMW) attenuation capacity and poor
Externí odkaz:
https://doaj.org/article/5918786e4e2746079f7ebd9825752ad4
Publikováno v:
IEEE Electron Device Letters. 42:1374-1377
In this letter, the redistribution layer-first embedded fan-out wafer-level packaging (RDL-first FO-WLP) for 2-D ultrasonic transducer arrays with individual electrical connection is proposed. This process provides the capability of manufacturing thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb1444c76ab20a912cc95b56841606f5
https://doi.org/10.1109/led.2021.3100064
https://doi.org/10.1109/led.2021.3100064
Publikováno v:
Electronics
Volume 12
Issue 3
Pages: 696
Volume 12
Issue 3
Pages: 696
This article presents an on-chip state-adjustable 8 GHz~12 GHz low-noise amplifier (LNA). It has two characteristics. First, an improved current reuse topology is proposed. By connecting a small capacitor in parallel with the drain of the first-stage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f2a678498a35013f3a8c1776bc8d5cc4
https://doi.org/10.3390/electronics12030696
https://doi.org/10.3390/electronics12030696
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:845-853
The fan-out package is designed to provide increased I/O density within a reduced form factor at a lower cost, as well as good electrical performance and heterogeneous integration capabilities, which has gained significant attention in recent years.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe518dd7fc57e1a110548ced2b2ebb3d
https://doi.org/10.1109/tcpmt.2019.2907295
https://doi.org/10.1109/tcpmt.2019.2907295
Publikováno v:
Journal of Materiomics, Vol 10, Iss 1, Pp 190-199 (2024)
Developing low density and efficient dielectric loss materials has become a research hotspot, which can greatly meet the demands of modern radars and settle the problem of electromagnetic wave pollution. Herein, a series of N-doped ordered mesoporous
Externí odkaz:
https://doaj.org/article/8d0f0349a8b3428a85a0c5985b5c4abf
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The idea that employs an advanced package that combines Embedded Substrate Level Package with Fan-out Substrate Level Package is proposed to package high-density and high-frequency ultrasound transducer array. We successfully verified the process pri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a49ed4681f6e581350be557639f29fbc
https://doi.org/10.1109/ectc32862.2020.00079
https://doi.org/10.1109/ectc32862.2020.00079
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1967-1978
In the current 4G Long Term Evolution and the incoming 5G mobile communication technology, as the number of radio frequency (RF) devices in the RF front-end module is increasing fast, miniaturization is essential and significant. The 3-D RF system-in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cbf263e591a96f0a91695c862292828
https://doi.org/10.1109/tcpmt.2018.2842084
https://doi.org/10.1109/tcpmt.2018.2842084
Publikováno v:
IEICE Electronics Express. 18:20210303-20210303
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::727d6a10d51d131e8b8185cbae2cdc31
https://doi.org/10.1587/elex.18.20210303
https://doi.org/10.1587/elex.18.20210303