Zobrazeno 1 - 10
of 316
pro vyhledávání: '"Lixi Wan"'
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2069 (2023)
This brief proposes a 1–6 GHz broadband double-balanced mixer. On the basis of the standard Marchand balun mixer, two techniques to enhance the performance of the mixer are proposed. Firstly, by loading capacitors, the amplitude and phase imbalance
Externí odkaz:
https://doaj.org/article/6686c57176354d5ebbf5628a262d8e44
Publikováno v:
Micromachines, Vol 14, Iss 2, p 356 (2023)
This paper presents some techniques to improve the linearity of traditional resistive feedback PGAs. By utilizing the switched op-amp in the PGA, the MOS switches in the feedback resistor array can be eliminated and thus the PGA’s linearity can be
Externí odkaz:
https://doaj.org/article/ad6ea01088b44dd5999301e848eea432
Publikováno v:
IEEE Electron Device Letters. 42:1374-1377
In this letter, the redistribution layer-first embedded fan-out wafer-level packaging (RDL-first FO-WLP) for 2-D ultrasonic transducer arrays with individual electrical connection is proposed. This process provides the capability of manufacturing thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb1444c76ab20a912cc95b56841606f5
https://doi.org/10.1109/led.2021.3100064
https://doi.org/10.1109/led.2021.3100064
Publikováno v:
Electronics
Volume 12
Issue 3
Pages: 696
Volume 12
Issue 3
Pages: 696
This article presents an on-chip state-adjustable 8 GHz~12 GHz low-noise amplifier (LNA). It has two characteristics. First, an improved current reuse topology is proposed. By connecting a small capacitor in parallel with the drain of the first-stage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f2a678498a35013f3a8c1776bc8d5cc4
https://doi.org/10.3390/electronics12030696
https://doi.org/10.3390/electronics12030696
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:845-853
The fan-out package is designed to provide increased I/O density within a reduced form factor at a lower cost, as well as good electrical performance and heterogeneous integration capabilities, which has gained significant attention in recent years.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe518dd7fc57e1a110548ced2b2ebb3d
https://doi.org/10.1109/tcpmt.2019.2907295
https://doi.org/10.1109/tcpmt.2019.2907295
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The idea that employs an advanced package that combines Embedded Substrate Level Package with Fan-out Substrate Level Package is proposed to package high-density and high-frequency ultrasound transducer array. We successfully verified the process pri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a49ed4681f6e581350be557639f29fbc
https://doi.org/10.1109/ectc32862.2020.00079
https://doi.org/10.1109/ectc32862.2020.00079
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1967-1978
In the current 4G Long Term Evolution and the incoming 5G mobile communication technology, as the number of radio frequency (RF) devices in the RF front-end module is increasing fast, miniaturization is essential and significant. The 3-D RF system-in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cbf263e591a96f0a91695c862292828
https://doi.org/10.1109/tcpmt.2018.2842084
https://doi.org/10.1109/tcpmt.2018.2842084
Publikováno v:
IEICE Electronics Express. 18:20210303-20210303
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::727d6a10d51d131e8b8185cbae2cdc31
https://doi.org/10.1587/elex.18.20210303
https://doi.org/10.1587/elex.18.20210303
Publikováno v:
Microelectronics Reliability. 79:38-47
The RF SiP module based on LTCC substrate has attracted considerable attention in wireless communications for the last two decades. However, the thermo-mechanical reliability of this 3D LTCC architecture has not been well-studied as common as its tra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::562ea21339ad8be666dc53ea72248922
https://doi.org/10.1016/j.microrel.2017.10.003
https://doi.org/10.1016/j.microrel.2017.10.003
Publikováno v:
Journal of Electronic Testing. 33:741-750
Near-field measurement, as an efficient method for studying the electromagnetic interference (EMI) problem, is becoming increasingly important. The calibration of the near-field probe is a critical part in the measurement procedure. This paper presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::938a0f4bf5e632828dd2680c19bea86d
https://doi.org/10.1007/s10836-017-5691-8
https://doi.org/10.1007/s10836-017-5691-8