Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Livio Gobbato"'
Autor:
Matteo Tremolada, Olivier Kermarrec, Mark Andrew Shaw, Xueren Zhang, Fabio Pietro Fiabane, Roberto Curti, Massimo Fere, Livio Gobbato, Carine Besset
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Recent progress made in Silicon Photonics building blocks has paved the way for large scale industrialisation of devices that can be fabricated in existing CMOS fabs, and recently important steps have also been taken on the industrialisation on 12″
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af68c8cb46287a27a29b80c55cda1f75
https://doi.org/10.1109/eptc.2016.7861446
https://doi.org/10.1109/eptc.2016.7861446
Autor:
Morgan Cason, Claudio Maria Villa, Luca Manfredi, Giuseppe Livio Gobbato, Maurizio Nessi, Paolo Pulici, Raffaele Ricci
Publikováno v:
Microelectronics Reliability. 52:2010-2013
Copper wire introduction in IC industry is showing new and interesting challenges. In this paper, we present the experimental observations and theoretical hypothesis of copper wire degradation under thermal stress in pulsed current condition. The rea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7ceaa02a5cb6042e8a02b0915c565e7
https://doi.org/10.1016/j.microrel.2012.06.059
https://doi.org/10.1016/j.microrel.2012.06.059