Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Living material with engineered genetic circuits"'
Publikováno v:
Materials Today Bio, Vol 18, Iss , Pp 100504- (2023)
Natural materials such as bone, wood, and bamboo can inspire the fabrication of stiff, lightweight structural materials. Biofilms are one of the most dominant forms of life in nature. However, little is known about their physical properties as a stru
Externí odkaz:
https://doaj.org/article/cf608df5e34a4ad89a683fedee9ab9ee
Akademický článek
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Autor:
Park H; Synthetic Biology Group, Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Synthetic Biology Center, Department of Biological Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Schwartzman AF; Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Tang TC; Synthetic Biology Group, Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Synthetic Biology Center, Department of Biological Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Wang L; Synthetic Biology Center, Department of Biological Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA., Lu TK; Synthetic Biology Group, Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Synthetic Biology Center, Department of Biological Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.
Publikováno v:
Materials today. Bio [Mater Today Bio] 2022 Nov 26; Vol. 18, pp. 100504. Date of Electronic Publication: 2022 Nov 26 (Print Publication: 2023).