Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Liujue Wang"'
Publikováno v:
Journal of Materials Research and Technology, Vol 22, Iss , Pp 1812-1820 (2023)
In this paper, the oxidation thermodynamics and oxidation kinetics of Au-20Sn solder at various temperatures were analyzed. The results indicated that the critical oxygen partial pressure to form SnO and SnO2 in Au-20Sn solder could be 1 × 10−44 P
Externí odkaz:
https://doaj.org/article/1fca4471916c4c088ed226b47ff4ff16
Publikováno v:
Materials Research Express, Vol 9, Iss 11, p 116512 (2022)
This study focuses on investigating the relationship between sintering performance and bond layer thickness for the hybrid Ag paste consisting of micrometer-sized Ag particles and sub-micrometer Ag spherical particles. The surface morphology showed t
Externí odkaz:
https://doaj.org/article/56a95faeee6648e286b93eaba5ad44b0
Publikováno v:
Crystals, Vol 11, Iss 6, p 601 (2021)
The Au-20Sn solder is widely used in the packaging of high-end electronic products, and the requirement on the reliability of the solder joints is more and more strict with a continuous increase in the performance of the package products. As the oxyg
Externí odkaz:
https://doaj.org/article/91075d70e0a64104956f7b64fbbafc80
Publikováno v:
Journal of Materials Engineering and Performance. 32:4427-4436
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3eb0b7d7c8de11661f6fce1d9b6abd69
https://doi.org/10.1007/s11665-022-07411-1
https://doi.org/10.1007/s11665-022-07411-1
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:7200-7210
Owing to the excellent stability and mechanical strength, AuSn20 solder is of particular importance to the die attachment in aerospace power modules. An elevated requirement was put forward to improve the performance of solder joints for next-generat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a039e028a173f901be97a5b3e9a7cf3f
https://doi.org/10.1007/s10854-020-03292-z
https://doi.org/10.1007/s10854-020-03292-z
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:1411-1420
In soldering process, oxygen trapped in solder often leads to reliability issues. In order to determine basic mechanisms, five commercial Au-20Sn solder preforms with different oxygen content were studied. The XPS results revealed that the surface ox
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c02cade24f8e41a0968ef187027151d
https://doi.org/10.1007/s10854-019-02655-5
https://doi.org/10.1007/s10854-019-02655-5
Publikováno v:
Crystals
Volume 11
Issue 6
Crystals, Vol 11, Iss 601, p 601 (2021)
Volume 11
Issue 6
Crystals, Vol 11, Iss 601, p 601 (2021)
The Au-20Sn solder is widely used in the packaging of high-end electronic products, and the requirement on the reliability of the solder joints is more and more strict with a continuous increase in the performance of the package products. As the oxyg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4d775b0bcb6b05686e69ad4c23d18a26
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:21130-21137
In order to understand the reliability relationship between solderability and oxygen content which on the surface of Au–20Sn solders, the wettability, microstructure and solderability of Au–20Sn solders with different oxygen content have been inv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::520b737c084dde71168312fecb7bff29
https://doi.org/10.1007/s10854-018-0261-0
https://doi.org/10.1007/s10854-018-0261-0
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:20726-20733
In order to meet the reliability requirement of solder joints for future small satellite, the effect of γ-ray irradiation on the microstructure and mechanical property of Sn63Pb37 solder joints was investigated by scanning electron microscope observ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfcddaeed6529078274cc18432739c1e
https://doi.org/10.1007/s10854-018-0213-8
https://doi.org/10.1007/s10854-018-0213-8
Publikováno v:
Journal of Materials Science: Materials in Electronics. 27:12729-12763
Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have been extensively investigated. With the extensive prevalence of 3D IC package, a major concern of Sn–Ag–Cu based solders today is continuously focused on extending
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e41e8f8285a9e58f3a5438cbd9fbdd29
https://doi.org/10.1007/s10854-016-5407-3
https://doi.org/10.1007/s10854-016-5407-3