Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Liu, Shoufu"'
Publikováno v:
In Ocean Engineering 15 October 2024 310 Part 1
Akademický článek
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Akademický článek
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Publikováno v:
2022 IEEE 11th Data Driven Control and Learning Systems Conference (DDCLS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44f671f16e52e1e7b101606b91477837
https://doi.org/10.1109/ddcls55054.2022.9858356
https://doi.org/10.1109/ddcls55054.2022.9858356
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
With the continuous progress of chip integration, the three-dimensional integration technology based on silicon through-hole (TSV) has emerged and become one of the key technologies to achieve high-density system integration. However, its process siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bff8b82fba827b6b87aca74a27251af5
https://doi.org/10.1109/icept52650.2021.9568038
https://doi.org/10.1109/icept52650.2021.9568038
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
This paper mainly uses ANSYS software to establish the finite element analysis model of SOP welded joints and analyze the stress distribution of SOP welded joints under bending load. A finite element model of the SOP device was developed for differen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0dd58f88ebb5a1411c06d8930574dd1
https://doi.org/10.1109/icept52650.2021.9567932
https://doi.org/10.1109/icept52650.2021.9567932
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In the process of studying the interconnection reliability of electronic products, due to the small size of the solder joints, the solder joint stress value of the chip cannot be directly measured by conventional methods, so this paper proposes a met
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4aa1279888596cf6961a4bf321a5fa5
https://doi.org/10.1109/icept52650.2021.9568048
https://doi.org/10.1109/icept52650.2021.9568048
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In this paper, a 3D finite element model of the solder joints of a 165-PIN PLASTIC FBGA (13x15) package was developed using ANSYS software according to the packaging of a static storage device. Then, the model was loaded with cantilever plate torsion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::893dcbfda3c9ce8475c54468dac3639f
https://doi.org/10.1109/icept52650.2021.9568156
https://doi.org/10.1109/icept52650.2021.9568156
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
The placement machine is an important component of the SMT equipment of the electronic manufacturing system. The placement rate is an important indicator for considering the SMT production efficiency. The placement machine will always have some failu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24e2b6d5814475ed54dc8391db2e84b8
https://doi.org/10.1109/icept50128.2020.9202960
https://doi.org/10.1109/icept50128.2020.9202960
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Three-point bending stress analysis was carried out on the model using ANSYS software. The single factor analysis method was used to study the influence of different factors on the stress and strain of the interconnection solder joint under three-poi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bc21f2802ded98040bdaad6937e22dd
https://doi.org/10.1109/icept50128.2020.9202907
https://doi.org/10.1109/icept50128.2020.9202907