Scalability of Tool Path Planning to Micro Machining

Autor: Litwinski, Kai M, Min, Sangkee, Lee, Dae-Eun, Dornfeld, David, Lee, Nakkyu

Publikováno v: Litwinski, Kai M; Min, Sangkee; Lee, Dae-Eun; Dornfeld, David; & Lee, Nakkyu. (2006). Scalability of Tool Path Planning to Micro Machining. Laboratory for Manufacturing and Sustainability. UC Berkeley: Laboratory for Manufacturing and Sustainability. Retrieved from: http://www.escholarship.org/uc/item/1m1132dv

Micromachining applications have received increased emphasis in recent years with the advent of new precision manufacturing applications which have stringent requirements for surface and edge finish. One of the main concerns in mi- cromachining is bu

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______325::50327e42b31496215c51f1dfe502227c
http://www.escholarship.org/uc/item/1m1132dv

Industrie 4.0 in der Zerspanung

Autor: Denkena, Berend, Litwinski, Kai M., Dahlmann, Dominik, Boujnah, Haythem, Kiesner, Johann, Krüger, Max, Schmidt, Justin, Neff, Thomas

Publikováno v: ZWF: Zeitschrift fuer den Wirtschaftlichen Fabrikbetrieb; August 2014, Vol. 109 Issue: 7-8 p537-541, 5p