Zobrazeno 1 - 10
of 446
pro vyhledávání: '"Lisong Dong"'
Publikováno v:
Opto-Electronic Advances, Vol 7, Iss 4, Pp 1-11 (2024)
Extreme ultraviolet (EUV) lithography with high numerical aperture (NA) is a future technology to manufacture the integrated circuit in sub-nanometer dimension. Meanwhile, source mask co-optimization (SMO) is an extensively used approach for advanced
Externí odkaz:
https://doaj.org/article/2feb540431a94d1194b5de2f44e7a687
Publikováno v:
Optics Express.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ff21703298318ae12d919ec5107c5d7
https://doi.org/10.1364/oe.488511
https://doi.org/10.1364/oe.488511
Publikováno v:
Novel Patterning Technologies 2023.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a8adfd5c69ca00e3d95191d19260791
https://doi.org/10.1117/12.2657812
https://doi.org/10.1117/12.2657812
Publikováno v:
Advances in Patterning Materials and Processes XL.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2462612f5b3cf07a4db3458cd95cd6a
https://doi.org/10.1117/12.2658664
https://doi.org/10.1117/12.2658664
Publikováno v:
DTCO and Computational Patterning II.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c78b4fdb9d2903a2964879a46bb0caf
https://doi.org/10.1117/12.2658126
https://doi.org/10.1117/12.2658126
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 35:309-317
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9bcf18c7d49470f76459e6f8b4df33a
https://doi.org/10.1109/tsm.2022.3143838
https://doi.org/10.1109/tsm.2022.3143838
Autor:
Shiling, Jia, Ling, Zhao, Xiangyu, Wang, Yunjing, Chen, Hongwei, Pan, Lijing, Han, Huiliang, Zhang, Lisong, Dong, Huixuan, Zhang
Publikováno v:
International Journal of Biological Macromolecules. 201:662-675
Poly (lactic acid) (PLA) blends with different toughening agents were prepared by melt compounding, and the effects of toughening agents on the toughness of PLA, especially the low-temperature toughness, were investigated. All blends were immiscible
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bbae442c07d73312b8564b0e4cf12052
https://doi.org/10.1016/j.ijbiomac.2022.01.126
https://doi.org/10.1016/j.ijbiomac.2022.01.126
Publikováno v:
Journal of Micro/Nanopatterning, Materials, and Metrology. 21
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83c8278f6987d057ccf4cc99605b075c
https://doi.org/10.1117/1.jmm.21.4.043204
https://doi.org/10.1117/1.jmm.21.4.043204
Publikováno v:
Journal of Microelectronic Manufacturing, Vol 1, Iss 1 (2018)
Micro-sieves have been widely used in medical treatment, quarantine, environment, agriculture, pharmacy and food processing. However, the manufacturing and yield improvement have been difficult due to multiple challenges, such as the sieve unit relea
Externí odkaz:
https://doaj.org/article/30202f05a1d94f2fa27b22686c52bd22
Publikováno v:
ACS Applied Polymer Materials. 3:5932-5941
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c6545243bda25190dd4c4a2baeaa540
https://doi.org/10.1021/acsapm.1c01189
https://doi.org/10.1021/acsapm.1c01189