Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Liske, Romy"'
Publikováno v:
In Microelectronic Engineering April 2013 104:48-57
Autor:
Yang, Hongliu, Krause, Robert, Scheunert, Christin, Liske, Romy, Uhlig, Benjamin, Preusse, Axel, Dianat, Arezoo, Bobeth, Manfred, Cuniberti, Gianaurelio
In the electrochemical deposition of copper on structured substrates, additives are commonly used as ingredients to refine the copper thin film properties. By means of cyclovoltametric (CV) measurements, we examine the process behavior of the additiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::e03e991289852886606b80a318ee1bfc
https://publica.fraunhofer.de/handle/publica/252641
https://publica.fraunhofer.de/handle/publica/252641
Publikováno v:
2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p143-146, 4p
Extending the 3ω-method to the MHz range for thermal conductivity measurements of diamond thin films
Autor:
Ahmed, Syed1, Liske, Romy1, Wunderer, Thomas1, Leonhardt, Michael1, Ziervogel, Ronny1, Fansler, Charlee1, Grotjohn, Tim1, Asmussen, Jes1, Schuelke, Thomas tschuelke@fraunhofer.org
Publikováno v:
Diamond & Related Materials. Feb2006, Vol. 15 Issue 2/3, p389-393. 5p.
Publikováno v:
ECS Transactions; April 2010, Vol. 25 Issue: 38 p3-17, 15p
Autor:
Koch, Johannes, Bott, Sascha, Wislicenus, Marcus, Krause, Robert, Gerlich, Lukas, Uhlig, Benjamin, Liske, Romy, Vasilev, Boris, Preusse, Axel
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014; 2014, p62-62, 1p
Autor:
Preusse, Axel, Hahn, Jens, Chowdhury, Tamjid, Hintze, Bernd, Liske, Romy, Nopper, Markus, Stoeckgen, Uwe
Publikováno v:
2012 IEEE International Interconnect Technology Conference; 1/ 1/2012, p1-1, 1p