Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Lisa Laflame"'
Publikováno v:
Proceedings of the 10th Unconventional Resources Technology Conference.
Publikováno v:
Geophysical Journal International. 222:2147-2161
SUMMARY A 2-D orthogonal distributed acoustic sensing (DAS) array designed for seismic experiments was buried horizontally beneath the Kafadar Commons Geophysical Laboratory on the Colorado School of Mines campus at Golden, Colorado. The DAS system u
Autor:
Martin Karrenbach, Zefeng Li, Zhongwen Zhan, Ethan Williams, Victor Yartsev, Vlad Bogdanov, Xin Wang, Andrew Klesh, Lisa LaFlame, Zhichao Shen, Steve Cole
Publikováno v:
SEG Technical Program Expanded Abstracts 2020.
Publikováno v:
Fifth International Conference on Engineering Geophysics, Al Ain, UAE, 21–24 October 2019.
Autor:
Paul A. Milligan, David Dushman, Alex Goertz, Martin Karrenbach, Bjorn Paulsson, J. Andres Chavarria, Lisa LaFlame, Alan Hardin, Vlad Soutyrine
Publikováno v:
The Leading Edge. 26:770-776
Vertical seismic profiling (VSP) technology is increasingly being used in the fields of earthquake seismology and tectonics. This is motivated in part by the growing number of oil field microseismic monitoring surveys, but more so by projects that in
Autor:
Melissa Emuh, Martin Karrenbach, Jason Gumble, Lisa LaFlame, Bill Bartling, Steve Cole, Steve Roche, Victor Yartsev
Publikováno v:
SEG Technical Program Expanded Abstracts 2015.
Interferometric imaging of microseismic data can provide high-resolution images of the subsurface. Each microseismic event can be used as a seismic source to image the subsurface in the vicinity of the event location. Combining thousands of events yi
Autor:
Martin Karrenbach, Andres Chavarria, Melissa Emuh, Victor Yartsev, Steve Cole, Ekaterina Hardin, Lisa LaFlame
Publikováno v:
SEG Technical Program Expanded Abstracts 2014.
Summary High-temperature and high-pressure subsurface environments pose challenges to traditional seismic sensors and recording equipment. Recent developments in fiberoptic sensor technology have made it possible to manufacture highly sensitive three