Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Lisa Figge"'
Autor:
Shawming Ma, L.M. MacInnes, N. Hendricks, C.A. Treadwell, Nigel P. Hacker, J. Dunne, Lisa Figge, G.W. Ray, J.C. Sum, R. Kavari
Publikováno v:
Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).
Process integration of a /spl kappa/=2.5 spin-on dielectric polymer into double-level metal CMOS parametric test structures at two technology nodes (0.35 /spl mu/m and 0.18 /spl mu/m) is described. This was accomplished using a single-coat, DOM (dire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5978ed6df4d2e732f2fad8bd6df00aa
https://doi.org/10.1109/iitc.1999.787116
https://doi.org/10.1109/iitc.1999.787116
Publikováno v:
Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).
A new spin-on-polymer with excellent physical and mechanical properties is described. Accuspin/sup R/ T-24 is a siloxane based polymer which has a dielectric constant of 2.5 after cure, the lowest reported for this class of materials. In addition, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::603fb5d2a9360b1cd9dd1001a9ff5611
https://doi.org/10.1109/iitc.1998.704925
https://doi.org/10.1109/iitc.1998.704925
Autor:
Gary Davis, Jan Nedbal, Nigel P. Hacker, Lisa Figge, Scott Lefferts, Todd Krajewski, Richard Spear
Publikováno v:
MRS Proceedings. 476
The properties of three types of Si-O polymers have been described. The newer methylsilsesquioxanes and inorganic polymers have low dielectric constant because the silanol has been eliminated form the cured film. Both types of low k materials, after
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4293525bcaa07af8dd8b13e88353380f
https://doi.org/10.1557/proc-476-25
https://doi.org/10.1557/proc-476-25
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.