Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Lior Huli"'
Autor:
Cong Que Dinh, Seiji Nagahara, Yuhei Kuwahara, Arnaud Dauendorffer, Keisuke Yoshida, Soichiro Okada, Tomoya Onitsuka, Shinichiro Kawakami, Satoru Shimura, Makoto Muramatsu, Kosuke Yoshihara, John S. Petersen, Danilo De Simone, Philippe Foubert, Geert Vandenberghe, Lior Huli, Steven Grzeskowiak, Alexandra Krawicz, Nayoung Bae, Kanzo Kato, Kathleen Nafus, Angélique Raley
Publikováno v:
Journal of Photopolymer Science and Technology. 35:87-93
Autor:
Yuhei Kuwahara, Shinichiro Kawakami, Kanzo Kato, Soichiro Okada, Yuya Kamei, Tomoya Onitsuka, Takashi Yamauchi, Nanoka Miyahara, Congque Dinh, Lior Huli, Satoru Shimura
Publikováno v:
Advances in Patterning Materials and Processes XL.
Autor:
Kanzo Kato, Lior Huli, Nathan Antonovich, David Hetzer, Steven Grzeskowiak, Eric Liu, Akiteru Ko, Satoru Shimura, Shinichiro Kawakami, Takahiro Kitano, Seiji Nagahara, Luciana Meli, Indira Seshadri, Martin Burkhardt, Karen Petrillo
Publikováno v:
Advances in Patterning Materials and Processes XL.
Autor:
Cong Que Dinh, Seiji Nagahara, Yuhei Kuwahara, Arnaud Dauendorffer, Soichiro Okada, Seiji Fujimoto, Shinichiro Kawakami, Satoru Shimura, Makoto Muramatsu, Kayoko Cho, Xiang Liu, Kathleen Nafus, Michael A. Carcasi, Ankur Agarwal, Mark H. Somervell, Lior Huli, Kanzo Kato, Michael Kocsis, Peter De Schepper, Stephen T. Meyers, Lauren McQuade, Kazuki Kasahara, Jara Garcia Santaclara, Rik Hoefnagels, Chris Anderson, Patrick Naulleau
Publikováno v:
Advances in Patterning Materials and Processes XL.
Autor:
Seiji Nagahara, Arnaud Dauendorffer, Xiang Liu, Tomoya Onitsuka, Hisashi Genjima, Noriaki Nagamine, Yuhei Kuwahara, Yuya Kamei, Shinichiro Kawakami, Makoto Muramatsu, Satoru Shimura, Kathleen Nafus, Noriaki Oikawa, Yannick Feurprier, Marc Demand, Sophie Thibaut, Alexandra Krawicz, Steven Grzeskowiak, Katie Lutker-Lee, Eric Liu, Christopher Catano, Joshua D. LaRose, Jeffrery C. Shearer, Lior Huli, Philippe Foubert, Danilo De Simone
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2022.
Autor:
Kanzo Kato, Lior Huli, David Hetzer, Steven Grzeskowiak, Alexandra Krawicz, Nayoung Bae, Satoru Shimura, Shinichiro Kawakami, Yuhei Kuwahara, Cong Que Dinh, Soichiro Okada, Takahiro Kitano, Seiji Nagahara, Akihiro Sonoda
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2022.
Autor:
Kanzo Kato, Lior Huli, Dave Hetzer, Satoru Shimura, Shinichiro Kawakami, Soichiro Okada, Takahiro Kitano, Akihiro Sonoda, Karen Petrillo, Luciana Meli, Cody Murray, Alex Hubbard
Publikováno v:
Advances in Patterning Materials and Processes XXXIX.
Autor:
Angélique Raley, Lior Huli, Steven Grzeskowiak, Katie Lutker-Lee, Alexandra Krawicz, Yannick Feurprier, Eric Liu, Kanzo Kato, Kathleen Nafus, Arnaud Dauendorffer, Nayoung Bae, Josh LaRose, Andrew Metz, Dave Hetzer, Masanobu Honda, Tetsuya Nishizuka, Akiteru Ko, Soichiro Okada, Yasuyuki Ido, Tomoya Onitsuka, Shinichiro Kawakami, Seiji Fujimoto, Satoru Shimura, Cong Que Dinh, Makoto Muramatsu, Peter Biolsi, Hiromasa Mochiki, Seiji Nagahara
Publikováno v:
Advanced Etch Technology and Process Integration for Nanopatterning XI.
Autor:
Dave Hetzer, Alexandra Krawicz, Luciana Meli, Alex Hubbard, Cody Murray, Christopher Cole, Shinichiro Kawakami, Karen Petrillo, Soichiro Okada, Akihiro Sonoda, Kanzo Kato, Lior Huli, Naoki Shibata, Satoru Shimura, Takahiro Kitano, Angelique Raley
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2021.
As the industry continues to push the limits of integrated circuit fabrication, reliance on EUV lithography has increased. Additionally, it has become clear that new techniques and methods are needed to mitigate pattern defectivity and roughness at L
Autor:
Yuanyi Zhang, Mark Somervell, Sean P. Berglund, Colton D'Ambra, Muramatsu Makoto, Rachel A. Segalman, Christopher M. Bates, Craig J. Hawker, Michael A. Carcasi, Lior Huli, Ryan L. Burns
Publikováno v:
Advances in Patterning Materials and Processes XXXVIII.
Bottom-up patterning approaches are gaining traction as the trade-offs between resolution, throughput, and cost continually run into limitations for advanced semiconductor manufacturing technologies. With these constraints in mind, we have previously