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Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Galvanic corrosion generally occurred on Al/Cu bond pads post wafer saw resulted in pitting but no pitting was observed at wafer incoming. There is significant interest in the corrosion behavior of Cu-containing Al alloy, such as PL455, which remain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2dad6f444bde2f53d388539544dc7f1b
https://doi.org/10.1109/ipfa.2015.7224391
https://doi.org/10.1109/ipfa.2015.7224391
