Effect of BOE Etching Time on Wire Bonding Quality.

Autor: Tan, Cher Ming, Linggajaya, Kaufik, Er, Eddie, Chai, Vincent Siew-Heong

Publikováno v: IEEE Transactions on Components & Packaging Technologies. Dec99, Vol. 22 Issue 4, p551. 7p. 1 Black and White Photograph, 4 Diagrams, 5 Charts, 12 Graphs.