Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ling Li Ong"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9d1ae6a649d92278c72a7e60b7d5630
https://doi.org/10.1109/eptc56328.2022.10013303
https://doi.org/10.1109/eptc56328.2022.10013303
Publikováno v:
2022 19th International SoC Design Conference (ISOCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c2d7822fc1b4ba2c2fd336f43e94ae2
https://doi.org/10.1109/isocc56007.2022.10031312
https://doi.org/10.1109/isocc56007.2022.10031312
Publikováno v:
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
This paper presents a novel approach of inductive compensation technique that is used in High-Speed I/O (HSIO) packaging which helps in meeting the return loss spec at package pins.The standard technique that is being followed in package design to me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::551af7c11f644eedb4c4919f66edff39
https://doi.org/10.1109/edaps.2018.8680857
https://doi.org/10.1109/edaps.2018.8680857
Publikováno v:
2014 IEEE International Conference on Semiconductor Electronics (ICSE2014).
Contactor pin is commonly used as the test tooling to enable million times of repeatability functional testing in manufacturing. Simulation should be performed before contactor sent for prototyping. The objective is to optimize the design according t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc38810de3bf4ca3f62864589a08fec6
https://doi.org/10.1109/smelec.2014.6920782
https://doi.org/10.1109/smelec.2014.6920782