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pro vyhledávání: '"Linda J. Baumgartner"'
Autor:
Ron Cooper, Linda J. Baumgartner, Richard L. Allor, R. K. Govila, Yi-Hsin Pao, Scott J. Badgley
Publikováno v:
Journal of Electronic Packaging. 114:135-144
Failures in electronic packages under thermal fatigue usually result from cracking in solder joints due to creep/fatigue crack growth. Understanding the stress/strain behavior of such solder joints is the first step in characterizing their fracture b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9e9f1ad8e0d48210dcbac9d913111fa
https://doi.org/10.1115/1.2906410
https://doi.org/10.1115/1.2906410
