Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Lincoln O'Riain"'
Autor:
Barbara Kuhn-Heinrich, Marc Strasser, Lincoln O'Riain, Stefano Aresu, Matthias Stecher, Alevtina Mayerhofer, Birgit von Ehrenwall, Cajetan Wagner, Ralf Rudolf, Paul Kuepper, Andreas von Ehrenwall, Karl-Heinz Gebhardt, Ulrich Glaser
Publikováno v:
2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs.
In this paper a 130 nm BCD technology platform is presented. The process offers logic-devices, flash-devices and high voltage devices with rated voltages up to 60 V. There are HV analog devices with variable channel length and HV power devices with l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fce1e8838b46d15db466559b922d9ea
https://doi.org/10.1109/ispsd.2011.5890780
https://doi.org/10.1109/ispsd.2011.5890780
Autor:
Barbara Hornig, Ulrike Feldner, Felix Braun, Lothar Brencher, Dirk Peters, Susanne Volkland, Daniel Sarlette, Jens Schneider, Oliver Luxenhofer, Lincoln O'Riain
Publikováno v:
SPIE Proceedings.
The fabrication of semiconductor devices can be complicated by various defectivity issues with respect to fabrication process steps, their interactions, the used materials and tool settings. In this paper we will focus on a defect type, called spire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5499b3f86b2626b131c5d3eb3cff288
https://doi.org/10.1117/12.879431
https://doi.org/10.1117/12.879431