Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Lin-zhen Jiang"'
Autor:
An, Qiang, Liu, Ting, Wang, Ming-yang, Yang, Yu-jia, Zhang, Zhen-dong, Lin, Zhen-jiang, Yang, Bing
Publikováno v:
OncoTargets and therapy
Qiang An, Ting Liu, Ming-yang Wang, Yu-jia Yang, Zhen-dong Zhang, Zhen-jiang Lin, Bing Yang Department of Gynecology, Affiliated Hospital of Zunyi Medical University, Zunyi, Guizhou 563000, People’s Republic of ChinaCorrespondence: Bing YangDepartm
Publikováno v:
Energy Conversion and Management. 81:10-18
A novel porous crack composite wick flattened heat pipe (PCHP) has been developed for electronic device cooling. PCHP was fabricated from grooved–sintered wick cylindrical heat pipe (GSHP) by phase change flattening technology. The composite wick w
Publikováno v:
Applied Thermal Engineering. 66:140-147
A novel porous crack composite wick flattened heat pipe (short for PCHP) was developed for the cooling of micro chips. PCHP was fabricated from grooved-sintered wick cylindrical heat pipe (short for GSHP) by phase change flattening technology. Porous
Publikováno v:
Journal of Central South University. 21:668-676
Some novel grooved-sintered composite wick heat pipes (GSHP) were developed for the electronic device cooling. The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering. The wi
Publikováno v:
Transactions of Nonferrous Metals Society of China. 24:292-301
Miniature cylindrical metal powder sintered wick heat pipe (sintered heat pipe) is an ideal component with super-high thermal efficiency for high heat flux electronics cooling. The sintering process for sintered wick is important for its quality. The
Publikováno v:
Transactions of Nonferrous Metals Society of China. 23:2714-2725
With the rapid rising of heat flux and reduction of heat dissipating space of microelectronic devises, flattened sintered heat pipe has become an ideal conducting element of use in the electronic cooling field. A manufacturing technology named phase
Publikováno v:
Applied Mechanics and Materials; June 2012, Vol. 184 Issue: 1 p534-537, 4p