Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Lin WMM"'
Autor:
Yarema M; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Yazdani N; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Yarema O; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Đorđević N; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Lin WMM; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Bozyigit D; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Volk S; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Moser A; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Turrini A; Integrated Systems Laboratory, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Khomyakov PA; Integrated Systems Laboratory, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Nachtegaal M; Paul Scherrer Institute, Villigen, 5232, Switzerland., Luisier M; Integrated Systems Laboratory, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland., Wood V; Institute for Electronics, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, 8092, Switzerland.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Nov; Vol. 36 (44), pp. e2406351. Date of Electronic Publication: 2024 Sep 05.
Autor:
Lin WMM; Department of Information Technology and Electrical Engineering, ETH Zurich, Switzerland., Yarema M; Department of Information Technology and Electrical Engineering, ETH Zurich, Switzerland;, Email: yaremam@ethz.ch., Liu M; Department of Electrical and Computer Engineering, University of Toronto, 10 King's College Road, Toronto, Ontario, M5S 3G4, Canada., Sargent E; Department of Electrical and Computer Engineering, University of Toronto, 10 King's College Road, Toronto, Ontario, M5S 3G4, Canada., Wood V; Department of Information Technology and Electrical Engineering, ETH Zurich, Switzerland;, Email: vwood@ethz.ch.
Publikováno v:
Chimia [Chimia (Aarau)] 2021 May 28; Vol. 75 (5), pp. 398-413.
Autor:
Yazdani N; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Andermatt S; Nano TCAD Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Yarema M; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Farto V; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Bani-Hashemian MH; Nano TCAD Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Volk S; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Lin WMM; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Yarema O; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Luisier M; Nano TCAD Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland., Wood V; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092, Zurich, Switzerland. vwood@ethz.ch.
Publikováno v:
Nature communications [Nat Commun] 2020 Jun 05; Vol. 11 (1), pp. 2852. Date of Electronic Publication: 2020 Jun 05.
Autor:
Lin WMM; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092 Zurich, Switzerland., Yazdani N; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092 Zurich, Switzerland., Yarema O; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092 Zurich, Switzerland., Volk S; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092 Zurich, Switzerland., Yarema M; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092 Zurich, Switzerland., Kirchartz T; IEK-5 Photovoltaik, Forschungszentrum Jülich GmbH, 52425 Jülich, Germany., Wood V; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, 8092 Zurich, Switzerland.
Publikováno v:
The Journal of chemical physics [J Chem Phys] 2019 Dec 28; Vol. 151 (24), pp. 241104.
Autor:
Yazdani N; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Jansen M; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Bozyigit D; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Lin WMM; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Volk S; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Yarema O; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Yarema M; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland., Juranyi F; Laboratory for Neutron Scattering and Imaging, Paul Scherrer Institute, CH-5232, Villigen PSI, Switzerland., Huber SD; Institute for Theoretical Physics, ETH Zurich, 8093, Zürich, Switzerland., Wood V; Materials and Device Engineering Group, Department of Information Technology and Electrical Engineering, ETH Zurich, Zurich, CH-8092, Switzerland. vwood@ethz.ch.
Publikováno v:
Nature communications [Nat Commun] 2019 Sep 17; Vol. 10 (1), pp. 4236. Date of Electronic Publication: 2019 Sep 17.
Autor:
Yazdani N; Department of Information Technology and Electrical Engineering , ETH Zurich , Zurich , 8092 Switzerland., Nguyen-Thanh T; European Synchrotron Radiation Facility , 71, Avenue des Martyrs , F-38000 Grenoble , France., Yarema M; Department of Information Technology and Electrical Engineering , ETH Zurich , Zurich , 8092 Switzerland., Lin WMM; Department of Information Technology and Electrical Engineering , ETH Zurich , Zurich , 8092 Switzerland., Gao R; Department of Information Technology and Electrical Engineering , ETH Zurich , Zurich , 8092 Switzerland., Yarema O; Department of Information Technology and Electrical Engineering , ETH Zurich , Zurich , 8092 Switzerland., Bosak A; European Synchrotron Radiation Facility , 71, Avenue des Martyrs , F-38000 Grenoble , France., Wood V; Department of Information Technology and Electrical Engineering , ETH Zurich , Zurich , 8092 Switzerland.
Publikováno v:
The journal of physical chemistry letters [J Phys Chem Lett] 2018 Apr 05; Vol. 9 (7), pp. 1561-1567. Date of Electronic Publication: 2018 Mar 14.
Autor:
Yarema M; Laboratory for Nanoelectronics, Department of Information Technology and Electrical Engineering, ETH Zurich, CH-8092, Zurich, Switzerland., Xing Y; Laboratory for Nanoelectronics, Department of Information Technology and Electrical Engineering, ETH Zurich, CH-8092, Zurich, Switzerland., Lechner RT; Institute of Physics, Montanuniversitaet Leoben, A-8700, Leoben, Austria., Ludescher L; Institute of Physics, Montanuniversitaet Leoben, A-8700, Leoben, Austria., Dordevic N; Laboratory for Nanoelectronics, Department of Information Technology and Electrical Engineering, ETH Zurich, CH-8092, Zurich, Switzerland., Lin WMM; Laboratory for Nanoelectronics, Department of Information Technology and Electrical Engineering, ETH Zurich, CH-8092, Zurich, Switzerland., Yarema O; Laboratory for Nanoelectronics, Department of Information Technology and Electrical Engineering, ETH Zurich, CH-8092, Zurich, Switzerland., Wood V; Laboratory for Nanoelectronics, Department of Information Technology and Electrical Engineering, ETH Zurich, CH-8092, Zurich, Switzerland. vwood@ethz.ch.
Publikováno v:
Scientific reports [Sci Rep] 2017 Sep 15; Vol. 7 (1), pp. 11718. Date of Electronic Publication: 2017 Sep 15.