Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Lin Cong-Ren"'
Publikováno v:
ICSPCC
There are many modulation formats (such as FSK, PSK, ASK) in the process of underwater acoustic communication, and the task of the signal modulation identification is to distinguish the format that used from signals which received from acoustic commu
Publikováno v:
Journal of Convergence Information Technology. 8:343-351
An Underwater acoustic channel is characterized as time-varying, multipath environment. Underwater localization is a key element in most underwater communication applications. Compared with the absolute positioning systems, the relative positioning s
Publikováno v:
OCEANS 2014 - TAIPEI.
In this paper we establish a packet loss model which meets the packet loss characteristics of underwater acoustic channel by pool experiment, so that we can simulate the packet loss characteristics of underwater acoustic channel on the computer, save
Publikováno v:
International Journal on Smart Sensing and Intelligent Systems, Vol 6, Iss 2 (2013)
This paper proposes a method of reduced-reference image quality assessment based on watermarking algorithm in underwater acoustic channel. By embedding the watermark image into the original one, then delivering the combined image through the channel
Publikováno v:
Electronics, Communications & Networks V; 2016, p411-419, 9p
Autor:
Lin, Cong-Ren, 林聰仁
89
With the emergence of B2B e-marketplace, it is anticipated to cause the transformation of market, change the present industrial structure, and then challenge the existence of inefficiency traditional market. B2B e-marketplace is considered a
With the emergence of B2B e-marketplace, it is anticipated to cause the transformation of market, change the present industrial structure, and then challenge the existence of inefficiency traditional market. B2B e-marketplace is considered a
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/41516721143700081445
Publikováno v:
Advanced Materials Research; September 2013, Vol. 765 Issue: 1 p562-566, 5p
Publikováno v:
Advanced Materials Research; January 2013, Vol. 655 Issue: 1 p882-885, 4p