Výsledky vyhledávání - "Lin, T.M.Z."

Conference

Identification and Layout Modification of Copper/Low k Interconnect Dielectric Reliability Assessment by using RVDB Test.

Autor: Lin, T.M.Z., Hsu, W.M., Lin, S.R., Wang, R.C.J., Chiu, C.C., Wu, K.

Publikováno v: 2006 IEEE International Reliability Physics Symposium Proceedings; 2006, p687-688, 2p

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Conference

Analysis of electric field distribution and its influence on dielectric failures in asymmetric copper interconnect structures.

Autor: Lin, T.M.Z., Hsu, W.M., Lee, S.Y., Chin, C.C., Wu, K.

Publikováno v: 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings 43rd Annual; 2005, p582-583, 2p

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