Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Lin, Rubin"'
Publikováno v:
In Integration November 2024 99
Autor:
Wu, Shien, Shi, Ge, Huang, Yuqing, Wang, Chenyu, Lin, Rubin, Shi, Mang, Sun, Yanwei, Wang, Binrui
Publikováno v:
In AEUE - International Journal of Electronics and Communications April 2024 177
Autor:
Shi, Ge, Wang, Chenyu, Qiao, Fei, Lin, Rubin, Wu, Shien, Sun, Yanwei, Shi, Mang, Han, Jianqiang
Publikováno v:
In Microelectronics Journal April 2024 146
Autor:
Shi, Ge, Wang, Chenyu, Qiao, Fei, Lin, Rubin, Wu, Shien, Shi, Mang, Sun, Yanwei, Han, Jianqiang, Wang, Binrui
Publikováno v:
In AEUE - International Journal of Electronics and Communications October 2023 170
Publikováno v:
In Microelectronics Journal March 2023 133
Akademický článek
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Autor:
Wang C; College of Mechanical and Electrical Engineering, China Jiliang University Hangzhou 310018 People's Republic of China shige@cjlu.edu.cn., Shi G; College of Mechanical and Electrical Engineering, China Jiliang University Hangzhou 310018 People's Republic of China shige@cjlu.edu.cn., Qiao F; Dept of Electronic Engineering, Tsinghua University Beijing 100084 People's Republic of China., Lin R; College of Mechanical and Electrical Engineering, China Jiliang University Hangzhou 310018 People's Republic of China shige@cjlu.edu.cn., Wu S; College of Mechanical and Electrical Engineering, China Jiliang University Hangzhou 310018 People's Republic of China shige@cjlu.edu.cn., Hu Z; College of Mechanical and Electrical Engineering, China Jiliang University Hangzhou 310018 People's Republic of China shige@cjlu.edu.cn.
Publikováno v:
Nanoscale advances [Nanoscale Adv] 2023 Mar 20; Vol. 5 (7), pp. 2118. Date of Electronic Publication: 2023 Mar 20 (Print Publication: 2023).