Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Lim Szu Shing"'
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
This paper focuses on the exposed-die molded underfill (MUF) and overmold as underfill (OMUF) technologies for flip chip in the form of a molded matrix array package. A series of mold compounds were selected for this evaluation. MUF and OMUF parts we
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e699f6a0c45e04dfb961d481571f1eef
https://doi.org/10.1109/eptc.2004.1396683
https://doi.org/10.1109/eptc.2004.1396683
Autor:
Ng Cheong Huat, Chee Choong Kooi, Shanggar Periaman, E. Then, Lim Szu Shing, J. Chui, Low Mun Fai
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
This paper discusses the work on capillary underfill and mold technology to assemble exposed die backside Flip Chip Molded Matrix Array. Parts were successfully assembled and subjected to reliability stress test. The interaction between capillary und
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b869940df949acf3ad406850781fc084
https://doi.org/10.1109/eptc.2003.1271539
https://doi.org/10.1109/eptc.2003.1271539
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p625-629, 5p
Autor:
Chee Choong Kooi, Lim Szu Shing, Periaman, S., Chui, J., Then, E., Ng Cheong Huat, Low Mun Fai
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003); 2003, p324-330, 7p