Zobrazeno 1 - 10
of 238
pro vyhledávání: '"Lim Ps"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this paper, an evaluation study was performed to reduce the epoxy molding film defects during vacuum lamination process. This epoxy mold film was vacuum laminated on fanout reconfigured silicon substrate; which was recognized as one of the key pro
Autor:
Phua Ts, Serine Soh, Hsiang-Yao Hsiao, Eva Wai, Guan Kian Lau, T. C. Chai, Sharon Lim Ps, S. C. Chong, Boon Long Lau, Wen Wei Seit, Simon Siak Boon Lim, David Ho, Yong Liang Ye, Sharon Lim Sh, Keith Cheng Sing Lim
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
With the slowing down of Moore's law, the semiconductor industry is increasingly looking to advanced packaging for achieving system scaling at packaging level. Across the industry, in high volume factories that support assembly and packaging of semic
Publikováno v:
IIUM Medical Journal Malaysia. 17
Hereditary Hemorrhagic Telangiectasia, also known as Osler-Weber-Rendu Syndrome is an autosomal dominant disorder causing systemic abnormalities of the vascular structure. There are multiple arteriovenous malformations present in the skin and mucosal
Publikováno v:
JWHG. :1-5
Objective: To compare the efficacy of medical evacuation using intravaginal Misoprostol 800 mcg eight-hourly in 24 hours with surgical evacuation in treating first trimester incomplete miscarriages. Study design: Randomised controlled trial for one-y
Autor:
Sharon Lim Ps, Ser Choong Chong, Chai Tai Chong, Simon Siak Boon Lim, Hsiao Hsiang-Yao, David Ho Soon Wee
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
In this paper, the fabrication process flow and results of a Fan out interposer for 2.5D system in package were presented. The Fan-out interposer can replace conventional through silicon interposer with reduction in both package size and cost. Fan-ou
Autor:
David Ho, Daniel Ismael, Chong Ser Choong, Ding Mian Zhi, Vempati Srinivasa Rao, Sharon Lim Ps, Chai Tai Chong, Ye Yong Liang
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper presents, the development of large multi-chip fan-out wafer level package (FOWLP) based Package-on-Package (PoP) using mold-First FOLWP integration flow for mobile applications. As part of this development, conventional mold-First FOWLP wa
Autor:
Sharon Lim Ps, Chai Tai Chong, Ye Yong Liang, Ding Mian Zhi, David Ho, Vempati Srinivasa Rao, Chong Ser Choong, Daniel Ismael
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of the consumer electronic products. However, conventional FOWLP technology is limited to small size packages with single c
Publikováno v:
In Value in Health September 2018 21 Supplement 2:S4-S4