Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Lim Beng Kuan"'
Publikováno v:
International Symposium on Microelectronics. 2014:000155-000160
Wafer Bumping In-line Process control of Wafer-Level Chip Scale Package (WLCSP) requires accurate measurement of bump features during processing. These bump features include critical dimension of Redistribution Layer (RDL), Under Bump Metal (UBM) and
Autor:
Tan Hien Boon, Rahamat Bidin, Krishnamoorthi Sivalingam, Anthony Yi Sheng Sun, F. Poh Ks, Lim Beng Kuan
Publikováno v:
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).
Leadframe CSP package had been well known to be a superior choice for high-speed application where high thermal performance is desired. With the advancement in technology trend, there is more increasing demand for higher thermal performance in miniat
Autor:
Zhou Wei, Lim Beng Kuan
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Solder joint fatigue failure is quite common in plastic ball grid array (BGA) packages. Accurately predicting solder joint fatigue life and developing advanced, efficient techniques of enhancing solder joint reliability are essential to package devel
Publikováno v:
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).
Due to an expanding consumer electronics market and the need for form factor reduction, stack packages have been gaining popularity in the last 3 years. With the incorporation of silicon die stacking, there is a corresponding increase in biomaterial
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Autor:
Poh KS, F., Tan Hien Boon, Krishnamoorthi Sivalingam, Lim Beng Kuan, Sun, A.Y.S., Rahamat Bidin
Publikováno v:
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585); 2004, p295-300, 6p
Publikováno v:
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585); 2004, p113-118, 6p
Autor:
Zhou Wei, Lim Beng Kuan
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003); 2003, p701-706, 6p