Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Lim, Ju Dy"'
Publikováno v:
In Thin Solid Films 31 July 2017 634:6-14
Publikováno v:
In Applied Surface Science 15 November 2015 355:509-515
Publikováno v:
In Microelectronics Reliability September-November 2013 53(9-11):1548-1552
Akademický článek
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Autor:
Chen Zhong, Wahyuaji Narotyama Putra, Wong Chee Cheong, I Made Riko, Eric Phua Jian Rong, Lim Ju Dy, Lau Fu Long, Lim Jun Zhang, Gan Chee Lip, Vivek Chidambaram Nachiappan
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
As deep earth oil exploration transits into deeper earth, it faces challenges in producing reliable microelectronics devices and sensors that will not degrade under a higher temperature and pressure environment. Numerous physical issues limit the man
Autor:
Lim Ju Dy, Eric Phua Jian Rong, Lim Jun Zhang, Ahmed Sharif, Gan Chee Lip, Daniel Rhee MinWoo, Lau Fu Long, Wong Chee Cheong, Chen Zhong, I Made Riko
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
The concept of Multichip module (MCM) packaging is popularized for evaluating prototypes of novel devices and materials in extreme environmental conditions. The packaging for these types of electronics must be mechanically well-built and the metalliz
Autor:
Eric Phua Jian Rong, I Made Riko, Wong Chee Cheong, Lim Ju Dy, Lim Jun Zhang, Ahmed Sharif, Ho Beng Yeung, Lau Fu Long
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
High temperature electronics for the exploration and monitoring of down-hole activities in geothermal wells and other oil and gas industry applications must operate reliably at a minimum temperature of 300°C for as long as 500 hours continuously. Th
Akademický článek
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