Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Lieven Degrendele"'
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9caa99dda3b89f37183922e5af839a8b
https://doi.org/10.1016/j.microrel.2017.04.008
https://doi.org/10.1016/j.microrel.2017.04.008
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
IC packages using mold compounds with low coefficient of thermal expansion (CTE) have been introduced in the last decade packages with basically no attention to its impact on board level reliability. In this study, the impact is shown for a large siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87c5b1ea76e0a3bca650bd268c369783
https://doi.org/10.1109/icep.2016.7486790
https://doi.org/10.1109/icep.2016.7486790
Autor:
Bart Vandevelde, Johan De Baets, Bart Allaert, Filip Vanhee, Geert Willems, Davy Pissoort, Ralph Lauwaert, Riet Labie, Lieven Degrendele
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::62d8152507a0b79bc919fbcf066b25c9
https://lirias.kuleuven.be/handle/123456789/603652
https://lirias.kuleuven.be/handle/123456789/603652
Autor:
Markus Kaufmann, Yang Yang, Tom Martens, Linde De Vriese, Steven Van Put, Thomas Vervust, Kristof Dhaenens, Lieven Degrendele, Bjorn Vandecasteele, Tsuyoshi Sekitani, Sheila Dunphy, Lothar Mader, Jan Vanfleteren
Publikováno v:
Advanced Electronic Materials. 4:1870037
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f56aec041cc069d8890919200bb88b2d
https://doi.org/10.1002/aelm.201870037
https://doi.org/10.1002/aelm.201870037
Autor:
Tom Martens, Linde De Vriese, Tsuyoshi Sekitani, Jan Vanfleteren, Lieven Degrendele, Bjorn Vandecasteele, Sheila Dunphy, Lothar Mader, Kristof Dhaenens, Thomas Vervust, Yang Yang, Markus Kaufmann, Steven Van Put
Publikováno v:
Advanced Electronic Materials. 4:1800071
Fiber-reinforced polymer composites with integrated intelligence, such as sensors, actuators, and communication capabilities, are desirable as infrastructures for the next generation of "internet of things." However, the shape mismatch between the 3D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b132aeb9de6283c6f324f625dcad84b0
https://doi.org/10.1002/aelm.201800071
https://doi.org/10.1002/aelm.201800071
Publikováno v:
Applied Surface Science. 252:2717-2740
Advanced printed circuit boards (PCBs) with sequential build-up (SBU) layers require alternating dielectric and copper layers on top of a core substrate. This can be achieved by lamination of resin coated copper (RCC) or by coating of dielectric poly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::689a1dce176e0493441e2286e0e2c950
https://doi.org/10.1016/j.apsusc.2005.04.027
https://doi.org/10.1016/j.apsusc.2005.04.027
Publikováno v:
26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003..
The plating of electroless Ni/Au as a solder for sequential buildup layers is investigated. Advanced printed circuit boards (PCB's) using sequential buildup layers with microvias require alternating dielectric and copper layers. This can be achieved
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb41550553323d4438d63f96ec214bb0
https://doi.org/10.1109/isse.2003.1260506
https://doi.org/10.1109/isse.2003.1260506