Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Liesbeth Reijnen"'
Autor:
Kaushik A. Kumar, Carlos Fonseca, Ton Kiers, Florin Cerbu, Christophe Beral, Guillaume Schelcher, Liesbeth Reijnen, Marc Demand, Mark John Maslow, Tae Kwon Jee, Vadim Timoshkov
Publikováno v:
Optical Microlithography XXXI.
Spacer-assisted pitch multiplication is a patterning technique that is used on many different critical layers for memory and logic devices. Pitch walk can occur when the spacer process, a combination of lithography, deposition and etch processes, pro
Autor:
Stijn Schoofs, Mu Feng, Kyohei Koike, Kumar Kaushik, Hidetami Yaegashi, Fumiko Yamashita, Vadim Timoshkov, Shota Yoshimura, Mark John Maslow, Liesbeth Reijnen, Shinya Morikita, Chris Spence, Kiyohito Ito, Carlos Fonseca, Peter Choi, Tae Kwon Jee
Publikováno v:
Advances in Patterning Materials and Processes XXXV.
Extreme UV(EUV) technology must be potential solution for sustainable scaling, and its adoption in high volume manufacturing(HVM) is getting realistic more and more. This technology has a wide capability to mitigate various technical problem in Multi
Autor:
Charlotte Chahine, Nader Shamma, David Hellin, Johan Vertommen, Michael Kubis, Katja Viatkina, Daniel Sobieski, Benjamin Kam, Philippe Leray, Liesbeth Reijnen, Melisa Luca, Rich Wise, Guillaume Mernier, Mircea Dusa, Patrick Jaenen, Girish Dixit, Jan Mulkens
Publikováno v:
SPIE Proceedings.
With shrinking design rules, the overall patterning requirements are getting aggressively tighter. For the 7-nm node and below, allowable CD uniformity variations are entering the Angstrom region (ref [1]). Optimizing inter- and intra-field CD unifor
Autor:
Katja Viatkina, Gian Lorusso, Liesbeth Reijnen, Roel Knops, Gijsbert Rispens, Ming Mao, Timon Fliervoet
Publikováno v:
Advances in Patterning Materials and Processes XXXII.
Contact Hole (CH) Local Critical Dimension Uniformity (LCDU) has a direct impact on device performance. As a consequence, being able to understand and quantifying the different LCDU contributors and the way they evolve during the various process step
Publikováno v:
Chemistry of Materials. 17:4142-4148
Thin films of CuxS are grown by chemical vapor deposition using Cu(thd)2 (thd = tetramethylheptanedionate), H2S, and H2 as the precursors. A deposition profile, not caused by depletion of the precursors, is present in all films. Hydrogen is needed fo
Publikováno v:
Chemistry of Materials. 17:2724-2728
Thin films of CuxS are deposited by both chemical vapor deposition (CVD) and atomic layer deposition (ALD) using copper bis-tetramethylheptanedionate, Cu(thd)2, and H2S as the precursors. Single-phase CuS and Cu1.8S can be deposited using both techni
Publikováno v:
The Journal of Physical Chemistry B. 108:9133-9137
A new approach to solar cell design is the use of nanostructured heterojunctions of inorganic materials such as n-type TiO 2 and p-type Cu 1 . 8 S, A major challenge is the deposition of the p-type material inside an n-type nanoporous matrix. In this
Publikováno v:
Chemical Vapor Deposition. 10:45-49
At present, chalcopyrites are widely studied as absorber materials for efficient, low-cost, thin film solar cells. The growth of CuInS 2 thin films by atomic layer deposition (ALD) is studied here. CuInS 2 films are grown on glass, TCO glass (SnO 2 :
Publikováno v:
Thin Solid Films. :492-496
Chalcopyrites are being studied widely as a promising absorber material for high-efficiency, low-cost, thin-film solar cells. The present paper deals with the growth of CuInS 2 thin films by atomic layer deposition. CuInS 2 films are grown on glass,
Publikováno v:
Materials Science and Engineering: C. 19:311-314
Thin films of p-type Cu 1.8 S have been deposited onto smooth and nanoporous n-type TiO 2 with Atomic Layer Chemical Vapor Deposition (AL-CVD). As precursors, Cu(thd) 2 and H 2 S have been used and self-limited deposition takes place between 125 and