Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Lien MB"'
Autor:
Zhang D; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Xu Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Huang Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Gutierrez AR; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Blocker CJ; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Liu CH; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Lien MB; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Cheng G; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Liu Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA., Chun IY; Department of Electrical Engineering, University of Hawai'i at Manoa, Honolulu, HI, USA. iychun@hawaii.edu., Fessler JA; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA. fessler@umich.edu., Zhong Z; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA. zzhong@umich.edu., Norris TB; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA. tnorris@umich.edu.
Publikováno v:
Nature communications [Nat Commun] 2021 Apr 23; Vol. 12 (1), pp. 2413. Date of Electronic Publication: 2021 Apr 23.
Autor:
Kim JY; Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109, USA., Han MG; Condensed Matter Physics and Materials Science Department, Brookhaven National Laboratory, Upton, NY 11973, USA., Lien MB; Department of Electrical Engineering, University of Michigan, Ann Arbor, MI 48109, USA., Magonov S; SPM Labs LLC, Tempe, AZ 85283, USA., Zhu Y; Condensed Matter Physics and Materials Science Department, Brookhaven National Laboratory, Upton, NY 11973, USA., George H; Department of Electrical Engineering, University of Michigan, Ann Arbor, MI 48109, USA., Norris TB; Department of Electrical Engineering, University of Michigan, Ann Arbor, MI 48109, USA., Kotov NA; Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109, USA.; Department of Chemical Engineering, University of Michigan, Ann Arbor, MI 48109, USA.; Department of Biomedical Engineering, University of Michigan, Ann Arbor, MI 48109, USA.; Biointerfaces Institute, University of Michigan, Ann Arbor, MI 48109, USA.
Publikováno v:
Science advances [Sci Adv] 2018 Feb 09; Vol. 4 (2), pp. e1700682. Date of Electronic Publication: 2018 Feb 09 (Print Publication: 2018).
Autor:
Lien MB; Department of Electrical Engineering, University of Michigan , Ann Arbor, Michigan 48109, United States., Kim JY; Department of Materials Science and Engineering, University of Michigan , Ann Arbor, Michigan 48109, United States., Han MG; Condensed Matter Physics and Materials Sciences Department, Brookhaven National Laboratory , Upton, New York 11973, United States., Chang YC; Department of Physics, University of Michigan , Ann Arbor, Michigan 48109, United States., Chang YC; Department of Electrical Engineering, National Changhua University of Education , Changhua City 500, Taiwan., Ferguson HJ; Department of Electrical Engineering, University of Michigan , Ann Arbor, Michigan 48109, United States., Zhu Y; Condensed Matter Physics and Materials Sciences Department, Brookhaven National Laboratory , Upton, New York 11973, United States., Herzing AA; National Institute of Standards and Technology , Gaithersburg, Maryland 20899, United States., Schotland JC; Department of Mathematics, University of Michigan , Ann Arbor, Michigan 48109, United States., Kotov NA; Department of Materials Science and Engineering, University of Michigan , Ann Arbor, Michigan 48109, United States., Norris TB; Department of Electrical Engineering, University of Michigan , Ann Arbor, Michigan 48109, United States.
Publikováno v:
ACS nano [ACS Nano] 2017 Jun 27; Vol. 11 (6), pp. 5925-5932. Date of Electronic Publication: 2017 Jun 02.
Autor:
N'Gom M; Department of Electrical & Computer Engineering, University of Michigan Ann Arbor, Ann Arbor, MI, 48109, USA. mngom@umich.edu., Lien MB; Department of Electrical & Computer Engineering, University of Michigan Ann Arbor, Ann Arbor, MI, 48109, USA., Estakhri NM; Department of Electrical & Computer Engineering, University of Michigan Ann Arbor, Ann Arbor, MI, 48109, USA., Norris TB; Department of Electrical & Computer Engineering, University of Michigan Ann Arbor, Ann Arbor, MI, 48109, USA., Michielssen E; Department of Electrical & Computer Engineering, University of Michigan Ann Arbor, Ann Arbor, MI, 48109, USA., Nadakuditi RR; Department of Electrical & Computer Engineering, University of Michigan Ann Arbor, Ann Arbor, MI, 48109, USA.
Publikováno v:
Scientific reports [Sci Rep] 2017 May 31; Vol. 7 (1), pp. 2518. Date of Electronic Publication: 2017 May 31.