Zobrazeno 1 - 10
of 114
pro vyhledávání: '"Lianxi Liu"'
Publikováno v:
Entropy, Vol 20, Iss 6, p 447 (2018)
During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening s
Externí odkaz:
https://doaj.org/article/17b16843030d4b509ddd7886d1a39a22
Publikováno v:
IEEE Transactions on Industrial Electronics. 70:6776-6785
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64aae3c4e8d4d584747c9bd3b03fcdf4
https://doi.org/10.1109/tie.2022.3204957
https://doi.org/10.1109/tie.2022.3204957
Autor:
Xiudeng Wang, Yinshui Xia, Ge Shi, Zhangming Zhu, Huakang Xia, Yidie Ye, Zhidong Chen, Libo Qian, Lianxi Liu
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 70:1795-1804
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1809553cd5dabd04fabfdf14bc344b78
https://doi.org/10.1109/tcsi.2022.3233111
https://doi.org/10.1109/tcsi.2022.3233111
Autor:
Xiudeng Wang, Yinshui Xia, Zhangming Zhu, Ge Shi, Huakang Xia, Yidie Ye, Zhidong Chen, Libo Qian, Lianxi Liu
Publikováno v:
IEEE Journal of Solid-State Circuits. 58:451-461
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5145a591110cb7646bddc19ab5e95411
https://doi.org/10.1109/jssc.2022.3182118
https://doi.org/10.1109/jssc.2022.3182118
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. :1-10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7a8fc7176eb9085009d755589786ee2
https://doi.org/10.1109/tvlsi.2023.3271984
https://doi.org/10.1109/tvlsi.2023.3271984
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. :1-11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65a556c39d00493b512518a92e35d27b
https://doi.org/10.1109/tcsi.2023.3277012
https://doi.org/10.1109/tcsi.2023.3277012
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 69:4218-4222
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5df7caa72f393c39ff92ff9e649ba11
https://doi.org/10.1109/tcsii.2022.3187979
https://doi.org/10.1109/tcsii.2022.3187979
Publikováno v:
IEEE Sensors Journal. 22:20593-20602
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a944b80c32ada5a0c5bbbf948071a969
https://doi.org/10.1109/jsen.2022.3205063
https://doi.org/10.1109/jsen.2022.3205063
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 69:3724-3728
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fcc0751a349d5a17aebfaa9fc5e18b1b
https://doi.org/10.1109/tcsii.2022.3181263
https://doi.org/10.1109/tcsii.2022.3181263
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 69:2794-2804
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bc1a62cf6832b911466c64040729eaf
https://doi.org/10.1109/tcsi.2022.3163801
https://doi.org/10.1109/tcsi.2022.3163801