Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Li-fang Feng"'
Autor:
Huan Wang, Tian-Xia Zheng, Nuo-Ya Yang, Ying Li, Hong Sun, Wei Dong, Li-Fang Feng, Jiu-Peng Deng, Meng-Chun Qi
Publikováno v:
Journal of Materials Chemistry B; 4/7/2023, Vol. 11 Issue 13, p2972-2988, 17p
Publikováno v:
Optoelectronics Letters. 16:211-215
With the development of visible light communication (VLC) and widespread applications of smart terminals with complementary- metal-oxide-semiconductor (CMOS) image sensor, researchers pay more and more attention in VLC systems with CMOS-based receive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1336a01f1b7b4fa7e713cb29a44d552
https://doi.org/10.1007/s11801-020-9085-2
https://doi.org/10.1007/s11801-020-9085-2
Publikováno v:
Applied Mechanics and Materials. 327:147-150
In this paper a novel quaternary alloy is formed by adding a small amount of rare earth Er (RE) into Bi5Sb8Sn solder alloy to improve its technological properties. The influences of Er on the resistivity and spreading properties of the novel solder a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c69b33a756af40394467e07beae8d18b
https://doi.org/10.4028/www.scientific.net/amm.327.147
https://doi.org/10.4028/www.scientific.net/amm.327.147
Publikováno v:
Journal of Electronics & Information Technology. 30:439-442
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::198882867b70a50bd0c5b69806536ae1
https://doi.org/10.3724/sp.j.1146.2006.01075
https://doi.org/10.3724/sp.j.1146.2006.01075
Publikováno v:
Applied Mechanics and Materials. :774-779
By alloying principle, a novel quaternary high-temperature lead-free solder was formed by adding trace Sn into Bi5Sb2Cu. The influences of trace Sn on the microstructure and mechanical properties of the novel solder alloy were systematically investig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dee61d29bfe17e4ff085b98eaf24479f
https://doi.org/10.4028/www.scientific.net/amm.34-35.774
https://doi.org/10.4028/www.scientific.net/amm.34-35.774
Publikováno v:
Materials Science Forum. :537-541
It is a difficult subject to develop the high temperature solder with thewhose melting point is within 250～450°C in solder field. Bi5Sb solder alloy whosewith the melting point of about is about 280°C is limited for itshas bad solderability and m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0160022bb9ac248e6bd35607fb5edaa2
https://doi.org/10.4028/www.scientific.net/msf.610-613.537
https://doi.org/10.4028/www.scientific.net/msf.610-613.537
Autor:
Li-fang Feng, Ping-zhi Fan
Publikováno v:
Journal of Zhejiang University SCIENCE A. 9:207-210
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f0f2f308e7a281813b8cdc512f4b07c
https://doi.org/10.1631/jzus.a071380
https://doi.org/10.1631/jzus.a071380
Publikováno v:
Tsinghua Science and Technology. 12:296-301
The creep properties of solder alloys are an important factor affecting the reliability of soldered joints in surface mount technologies. Particle-enhancement is one way to improve the properties of solder alloys. The temperature of the solder joint
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edcfb5f36ce343446635ec3957a37ab5
https://doi.org/10.1016/s1007-0214(07)70044-5
https://doi.org/10.1016/s1007-0214(07)70044-5
Publikováno v:
Dong wu xue yan jiu = Zoological research. 32(3)
Thirteen hsp70 genes with complete conserved domains were identified in Tetrahymena thermophila, and expression of five similar and non-intron hsp70 genes were analyzed. Under heat shock conditions of 37, 39 and 41oC, hsp70-2 mRNA had the highest rel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::89e564c7f635e12695b558978b3e7ce0
https://pubmed.ncbi.nlm.nih.gov/21698792
https://pubmed.ncbi.nlm.nih.gov/21698792