Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Li Carlos Rendler"'
Publikováno v:
2ND INTERNATIONAL CONFERENCE ON EMERGING SMART MATERIALS IN APPLIED CHEMISTRY (ESMAC-2021): ESMAC-2021.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df7290955c411931c18c94dfe1230139
https://doi.org/10.1063/5.0127402
https://doi.org/10.1063/5.0127402
Autor:
Achim Kraft, A.J. Beinert, Pascal Romer, Ulrich Eitner, Johann Walter, Steffen Wiese, Li Carlos Rendler, Sandor Stecklum
Publikováno v:
Solar Energy Materials and Solar Cells. 196:167-177
This study analyses thermomechanical stresses in silicon solar cells after the soldering process by finite element modeling. An experimentally validated model shows compressive and tensile stresses, longitudinal and transversal to a busbar or a pad r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74794c72a48cc895a8fc902ad1b6e893
https://doi.org/10.1016/j.solmat.2019.03.041
https://doi.org/10.1016/j.solmat.2019.03.041
Publikováno v:
Energy Procedia. 124:515-525
For the comparative study with focus on mechanical long-term stability, we perform a temperature cycle (TC) test-to-failure for 1250 cycles according to IEC 61215 with laminated solar cell strings. The strings were produced with Multi Busbar (MBB) so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6dfdf3132c11863a31e24de109c25663
https://doi.org/10.1016/j.egypro.2017.09.288
https://doi.org/10.1016/j.egypro.2017.09.288
Publikováno v:
Energy Procedia. 124:478-483
We propose an interconnection concept for solar cells that enables the soldering of solder coated copper wires directly on the contact fingers of the front side metallization without the need of busbars or contact pads. By reshaping the copper wires
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::822a611f34f233c2bd811fe46bf01e71
https://doi.org/10.1016/j.egypro.2017.09.284
https://doi.org/10.1016/j.egypro.2017.09.284
Autor:
Li Carlos Rendler, Ulrich Eitner
Publikováno v:
Energy Procedia. 92:500-504
The peel test of soldered/glued ribbons on solar cell metallizations is the critical test in the PV industry and research community to qualify the integrability of cells into modules. It has been shown that the peeling angle of the test setup strongl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::333fef1fa21f604919ac561dde0c6bba
Autor:
Achim Kraft, Ade P. Haryantho, Jonas D. Huyeng, Ulrich Eitner, Li Carlos Rendler, Johann Walter, Steffen Wiese
Publikováno v:
AIP Conference Proceedings.
In this work the reliability of silicon solar cells interconnected by wires soldered directly on the contact fingers of the front side grid is analyzed in detail. The interconnection of busbarless solar cells enables significant silver reduction. We
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ffb4493234d735214213a1389dbc03e2
https://doi.org/10.1063/1.5049303
https://doi.org/10.1063/1.5049303
Autor:
Christian Ebert, Roman Keding, Li Carlos Rendler, Ulrich Eitner, Alma Spribille, Jonas D. Huyeng
Publikováno v:
AIP Conference Proceedings.
This work describes interdigitated back-contact cells with a number of different rear side geometries, for different interconnection concepts and module integration, by means of numerical simulations. We show that a simple interconnection concept can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92135364af05c057111149ef6b660e05
https://doi.org/10.1063/1.5049250
https://doi.org/10.1063/1.5049250
In the manufacturing process of a common solar module, crystalline silicon solar cells are interconnected by soldering. Copper-based interconnectors, coated with a solder alloy are soldered on both sides of the solar cells on the contact metallizatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e4188c3bbb7fbd59b8c24560b5e58d69
https://publica.fraunhofer.de/handle/publica/251846
https://publica.fraunhofer.de/handle/publica/251846
Autor:
Ulrich Eitner, Johann Walter, Andreas Halm, Valentin D. Mihailetchi, Li Carlos Rendler, Achim Kraft
This work presents an interconnection approach for 6” back-contact back-junction (BC-BJ) solar cells by using conventional solder-coated copper ribbons with implemented wave structures for thermomechanical stress relief. We developed a process for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::20b42eccce8bfae2c7a6058327d5c2ba
https://publica.fraunhofer.de/handle/publica/250956
https://publica.fraunhofer.de/handle/publica/250956
Publikováno v:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The interconnection of silicon solar cells is commonly realized by soldering copper ribbons or wires with a solder coating onto screen-printed silver contacts. Due to the difference of the coefficient of thermal expansion (CTE) of copper and silicon,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4463e4fef0391613f80dce6e78443877
https://doi.org/10.1109/eurosime.2016.7463325
https://doi.org/10.1109/eurosime.2016.7463325