Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Lewis In Soo Kang"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
nSiP(nepes System in Package) platform technology has been developed and verified as a module concept SiP package which can contain various dies and multi passives by using WLP and fan-out related technologies for various applications. nSiP platform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8770db673d5346b3448e8036fb7e5397
https://doi.org/10.1109/ectc32696.2021.00020
https://doi.org/10.1109/ectc32696.2021.00020
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
The market of Connectivity, Internet of Things (IoT), Wearable and Smart industrial applications leads Fan Out Wafer Level Package (FOWLP) technologies to a promising solution to overcome the limitation of conventional wafer level package, flip chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13ad8c9e0471fc745ad2393dd1588b6e
https://doi.org/10.23919/icep.2017.7939429
https://doi.org/10.23919/icep.2017.7939429