Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Lester, Jacob"'
Autor:
Zhang, Hao, Jethani, Neil, Jones, Simon, Genes, Nicholas, Major, Vincent J., Jaffe, Ian S., Cardillo, Anthony B., Heilenbach, Noah, Ali, Nadia Fazal, Bonanni, Luke J., Clayburn, Andrew J., Khera, Zain, Sadler, Erica C., Prasad, Jaideep, Schlacter, Jamie, Liu, Kevin, Silva, Benjamin, Montgomery, Sophie, Kim, Eric J., Lester, Jacob
Publikováno v:
PLoS Digital Health; 12/11/2024, Vol. 3 Issue 12, p1-16, 16p
Autor:
Eric Blancaflor, Patricia Anne I. Caseńas, Lester Jacob H. Rocamora, Jose Immanuel Y. Rosete, William Rey
Publikováno v:
2022 International Communication Engineering and Cloud Computing Conference (CECCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42b9ae763e853efc62933fe4f1437cd6
https://doi.org/10.1109/ceccc56460.2022.10069218
https://doi.org/10.1109/ceccc56460.2022.10069218
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Braskie, Meredith N, Hazra, Nalini, Kothapalli, Deydeep, Cho, HyungJin, Lester, Jacob, Rogers, Jessica N, Palmer, Raymond F., Vintimilla, Raul, Johnson, Leigh, Yaffe, Kristine, Toga, Arthur W., O'Bryant, Sid E.
Publikováno v:
Alzheimer's & Dementia: The Journal of the Alzheimer's Association; Dec2022 Supplement 5, Vol. 18 Issue 5, p1-3, 3p
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
The tungsten-rhenium (WRe) 3mil cantilever probe is widely used in wafer probe at ON Semiconductors. The maximum current that can be supplied to a DUT is restricted by the current capacity of the probe needles. A typical 3 mil tip probe can carry 2 -
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45f148ec781ee126cf2092c8f77ca7ea
https://doi.org/10.1109/iemt.2008.5507796
https://doi.org/10.1109/iemt.2008.5507796
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Publikováno v:
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2008, p1-6, 6p
Autor:
Zhang H; NYU Grossman School of Medicine., Jethani N; NYU Grossman School of Medicine., Jones S; NYU Grossman School of Medicine., Genes N; NYU Grossman School of Medicine., Major VJ; NYU Grossman School of Medicine., Jaffe IS; NYU Grossman School of Medicine., Cardillo AB; NYU Grossman School of Medicine., Heilenbach N; NYU Grossman School of Medicine., Ali NF; NYU Grossman School of Medicine., Bonanni LJ; NYU Grossman School of Medicine., Clayburn AJ; NYU Grossman School of Medicine., Khera Z; NYU Grossman School of Medicine., Sadler EC; NYU Grossman School of Medicine., Prasad J; NYU Grossman School of Medicine., Schlacter J; NYU Grossman School of Medicine., Liu K; NYU Grossman School of Medicine., Silva B; NYU Grossman School of Medicine., Montgomery S; NYU Grossman School of Medicine., Kim EJ; NYU Grossman School of Medicine., Lester J; NYU Grossman School of Medicine., Hill TM; NYU Grossman School of Medicine., Avoricani A; NYU Grossman School of Medicine., Chervonski E; NYU Grossman School of Medicine., Davydov J; NYU Grossman School of Medicine., Small W; NYU Grossman School of Medicine., Chakravartty E; NYU Grossman School of Medicine., Grover H; NYU Grossman School of Medicine., Dodson JA; NYU Grossman School of Medicine., Brody AA; NYU Rory Meyers College of Nursing, NYU Grossman School of Medicine., Aphinyanaphongs Y; NYU Grossman School of Medicine., Masurkar A; NYU Grossman School of Medicine., Razavian N; NYU Grossman School of Medicine.
Publikováno v:
MedRxiv : the preprint server for health sciences [medRxiv] 2024 Feb 13. Date of Electronic Publication: 2024 Feb 13.