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pro vyhledávání: '"Leow Khim Han"'
Autor:
G. Viswanadam, Leow Khim Han
Publikováno v:
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
The paper introduces an overview of the lead free solder bumping process with a solder paste printing method. The bumping process and process variations for three different lead free solder pastes are discussed. Performance matrices include bump heig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c2fef5060f884ac217e9cd5157017d9
https://doi.org/10.1109/emap.2000.904127
https://doi.org/10.1109/emap.2000.904127
Autor:
Viswanadam, G., Leow Khim Han
Publikováno v:
International Symposium on Electronic Materials & Packaging (EMAP2000) (Cat. No.00EX458); 2000, p7-11, 5p