Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Leong Hung Yang"'
Autor:
Tan, Shi Hao a, Chuah, Joon Huang a, ∗, Chow, Chee-Onn a, Kanesan, Jeevan a, Leong, Hung Yang b
Publikováno v:
In Engineering Applications of Artificial Intelligence March 2024 129
Publikováno v:
Diffusion and Defect Data Part B: Solid State Phenomena; May 2023, Vol. 343 Issue: 1 p67-72, 6p
Autor:
Yap Boon Kar, R. Vithyacharan, Foong Chee Seng, Leong Hung Yang, Tan Chou Yong, Noor Azrma Tahk
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
This paper discusses the evaluation and characterizations of the cleaning the organic residues on Flip Chip Ceramic Ball Grid Array (FCCBGA) package. Flux used for Control Collapse Chip Connection (C4) die attachment during assemblies could remain on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::668f5c928085a13872f91aa1cc9c3fb2
https://doi.org/10.1109/eptc.2012.6507154
https://doi.org/10.1109/eptc.2012.6507154
Autor:
Faiz, Muhammad, Kar, Yap Boon, Leong, Hung Yang, Yong, Tan Chou, Siong, Chin Teck, C, Tan Lan
Publikováno v:
Regional Conference on Science, Technology & Social Sciences (RCSTSS 2014); 2016, p633-641, 9p
Autor:
Hock Jin Quah
Selected peer-reviewed extended articles based on abstracts presented at the 2nd International Conference on Semiconductor Materials and Technology (ICoSeMT 2021)Aggregated Book
Special topic volume with invited peer-reviewed papers only
This book emphasizes the emerging building block of image processing domain, which is known as capsule networks for performing deep image recognition and processing for next-generation imaging science. Recent years have witnessed the continuous deve