Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Leon Stiborek"'
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
This paper presents an improved 3D methodology developed to accurately model and characterize the performance impact of the package manufacturing process variations (viz. Au/Ni plating and AgCu) on drain to source resistance RDS(ON). DC resistance di
Autor:
Dwayne R. Shirley, Kuan H. Lu, Vikas Gupta, Paul S. Ho, Leon Stiborek, Yiwei Wang, Seung-Hyun Chae, Jay Im
Publikováno v:
Journal of Materials Research. 27:1131-1141
In this article, we investigated the effect of Sn grain structure on the electromigration (EM) reliability of Sn–2.5Ag (wt%) solder joints used in flip-chip packages. The electron backscattering diffraction technique was applied to characterize the
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
The anisotropic properties of the Sn crystal play an important role in the electromigration (EM) reliability of Sn-based Pb-free solder interconnects in flip chip packages. This study investigates the effect of the Sn grain structure on the EM lifeti
Autor:
Don Purinton, Leon Stiborek
Publikováno v:
MRS Proceedings. 189
Texas Instruments Defense Systems and Electronics Group develops radars, missile systems, infra-red systems and electronic systems for the Defense Department. Materials having special microwave properties are needed for radar systems, missile systems
Conference
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