Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Lennart Bamberg"'
Publikováno v:
IEEE Open Journal of Circuits and Systems, Vol 5, Pp 178-188 (2024)
Specialized compute blocks have been developed for efficient nn execution. However, due to the vast amount of data and parameter movements, the interconnects and on-chip memories form another bottleneck, impairing power and performance. This work add
Externí odkaz:
https://doaj.org/article/69f456498f434569bfd63a9cc0ff980d
Publikováno v:
IEEE Access, Vol 7, Pp 179220-179234 (2019)
Approximate computing has been broadly investigated in the computing domain to maintain the benefits of technology scaling. Recently, it has been extended to the communication domain. The idea is to trade transmission quality for energy or/and perfor
Externí odkaz:
https://doaj.org/article/c044fc1e49c2410580a3c4317016ecdc
Autor:
Jan Moritz Joseph, Lennart Bamberg, Dominik Ermel, Behnam Razi Perjikolaei, Anna Drewes, Alberto Garcia-Ortiz, Thilo Pionteck
Publikováno v:
IEEE Access, Vol 7, Pp 135145-135163 (2019)
Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and throughput
Externí odkaz:
https://doaj.org/article/740b62139bef4506842b1108a709090b
Publikováno v:
Technologies, Vol 8, Iss 1, p 10 (2020)
Core mapping, in which a core graph is mapped to a network graph to minimize communication, is a common design problem for Systems-on-Chip interconnected by a Network-on-Chip. In conventional multiprocessors, this mapping is area-agnostic as the core
Externí odkaz:
https://doaj.org/article/238e830993ae4f5093ad06e6df464ef7
Publikováno v:
Integration. 72:58-65
A precise high-level energy model is required for the development and efficiency characterization of on-chip low-power coding and stochastic techniques. The misalignment effect, that is the variation in the delay of the transmitted signals, is conven
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44842a7e7509803819929ee1df4a8f1b
https://doi.org/10.1016/j.vlsi.2020.01.001
https://doi.org/10.1016/j.vlsi.2020.01.001
Publikováno v:
3D Interconnect Architectures for Heterogeneous Technologies ISBN: 9783030982287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c45a6e524ee3bc250b288f2db629bad
https://doi.org/10.1007/978-3-030-98229-4_9
https://doi.org/10.1007/978-3-030-98229-4_9
Publikováno v:
3D Interconnect Architectures for Heterogeneous Technologies ISBN: 9783030982287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::56936ec59f0fb98ac791a27e9f244384
https://doi.org/10.1007/978-3-030-98229-4_5
https://doi.org/10.1007/978-3-030-98229-4_5
Publikováno v:
3D Interconnect Architectures for Heterogeneous Technologies ISBN: 9783030982287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da7114c58f7f4fcb617fabbe2e9ad130
https://doi.org/10.1007/978-3-030-98229-4_8
https://doi.org/10.1007/978-3-030-98229-4_8
Publikováno v:
3D Interconnect Architectures for Heterogeneous Technologies ISBN: 9783030982287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d5335450c250c535ea56e6c6e592a88
https://doi.org/10.1007/978-3-030-98229-4_7
https://doi.org/10.1007/978-3-030-98229-4_7
Publikováno v:
3D Interconnect Architectures for Heterogeneous Technologies ISBN: 9783030982287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7704f54639898ad0dd7d70c2d0a0defd
https://doi.org/10.1007/978-3-030-98229-4_2
https://doi.org/10.1007/978-3-030-98229-4_2