Three-dimensional packaging technologies for highly integrated T/R modules

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Publikováno v: Deborgies, F. ; Lemoine, Thierry ; Mancuso, Yves (1999) Three-dimensional packaging technologies for highly integrated T/R modules. In: Gallium Arsenide Applications Symposium. GAAS 1999, 4-5 October 1999, Bologna, Italy.

Future generations of avionic systems will be based on conformal antennas spread over the body of the aircraft. Smart skin systems will need highly integrated T/R modules (size below 2 cm2 at 10 GHz). To realise these modules, 3D integration of MMICs

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3e231dc59165169ff923b9dfa558e7f1

Functional analysis of the F337C mutation in the CLCN1 gene associated with dominant myotonia congenita reveals an alteration of the macroscopic conductance and voltage dependence.

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L'effet de la structure du réseau du dirigeant sur sa rémunération: Le cas français.

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