Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Lekhanh Dang"'
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
The development and deployment of very fast signaling technologies for communication across the backplane has introduced the need for a multidisciplinary design approach where the performance of the silicon to silicon communication channel is address
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b383a40dd756f71a945eb74e2da1ae24
https://doi.org/10.1109/ectc.2004.1319067
https://doi.org/10.1109/ectc.2004.1319067
Publikováno v:
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.
The radical rise in localized component density has forced designers to utilize extremely high density, high layer count printed circuit boards. These high layer counts make the board more difficult, and more expensive to fabricate, resulting in high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8397e19d5a113b28ca401fae2584ae76
https://doi.org/10.1109/iemt.2002.1032736
https://doi.org/10.1109/iemt.2002.1032736
Publikováno v:
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium; 2002, p115-122, 8p
Publikováno v:
2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1220-1220, 1p