Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Leijun Tang"'
Autor:
Arvind Sundarrajan, Bharat Bhushan, Leijun Tang, H. M. Calvin Chua, King-Jien Chui, Prayudi Lianto, Yu Gu, Guan Huei See, Ai Long Wu, Xin Wang, B. S. S. Chandra Rao
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1592-1597
Under-bump metallization R c is a critical metric for high-density interconnect in electronic devices. We developed a test vehicle to characterize the impact of unit processes on R c for 10- $\mu \text{m}$ polymer passivation opening. We demonstrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47f3fdf1a6abdaad437cc85df3a84a8e
https://doi.org/10.1109/tcpmt.2017.2726118
https://doi.org/10.1109/tcpmt.2017.2726118
Publikováno v:
ECS Meeting Abstracts. :742-742
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee8fd733fce14eafa889ef519166a4b0
https://doi.org/10.1149/ma2005-02/19/742
https://doi.org/10.1149/ma2005-02/19/742
Autor:
Swee Tiam Tan, Junliang Zhao, Iwan, S., Xiao Wei Sun, Xiaohong Tang, Jiandong Ye, Bosman, M., Leijun Tang, Guo-Qiang Lo, Teo, K. L.
Publikováno v:
IEEE Transactions on Electron Devices; Jan2010, Vol. 57 Issue 1, p129-133, 5p, 1 Black and White Photograph, 5 Graphs