Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Leigh Wojewoda"'
Autor:
Michael J. Hill, Chatterjee Prithwish, Srikrishnan Venkataraman, Hariri Haifa, Krishna Bharath, Kaladhar Radhakrishnan, Leigh Wojewoda, Sriram Srinivasan, Huong Do
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The package integrated inductors employed by Intel's Fully Integrated Voltage Regulator (FIVR) have had to scale in tandem with the circuits they power. This reduction in available volume has resulted in degraded inductor quality factor and reduced c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73f18b5289d3a64354e0c5a4780a9e2d
https://doi.org/10.1109/ectc32696.2021.00208
https://doi.org/10.1109/ectc32696.2021.00208
Autor:
Kaladhar Radhakrishnan, William J. Lambert, Malavarayan Sankarasubramanian, Ryan Mesch, Leigh Wojewoda, Yongki Min, Ashay A. Dani, Michael J. Hill, Anne Augustine, Jose Chavarria
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Circuit area scaling driven by Moore’s law coupled with the push to thinner packages for mobile microprocessors has reduced the volume available for Air Core Inductors (ACI). This translates to a reduction in the conversion efficiency of Fully Inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::737bea6f2faf9b0d329d2288607347fc
https://doi.org/10.1109/ectc32862.2020.00071
https://doi.org/10.1109/ectc32862.2020.00071
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:3-11
Intel fourth-generation and fifth-generation Core microprocessors are powered by high-frequency integrated switching voltage regulators. The inductors required to implement these regulators are constructed using the routing layers of conventional org
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acf135d39de8e1db35e36b7d732a4d1e
https://doi.org/10.1109/tcpmt.2015.2505665
https://doi.org/10.1109/tcpmt.2015.2505665
Publikováno v:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Increasing high speed data rates for digital signaling and emerging technologies such as 5G have expanded the frequency range of interest for package dielectric materials characterization and generated interest in characterization over use conditions
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d1a2b1ba195fa4594539c1fbcd37142
https://doi.org/10.1109/epeps.2018.8534242
https://doi.org/10.1109/epeps.2018.8534242
Publikováno v:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
The introduction of new dielectrics and adhesion promotion techniques for future interconnect technology generations is one of the key enablers for lower loss and higher bandwidth. However, temperature increase due to active die or environmental fact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e9d9c5fa46ada1320f1c2beeae09459
https://doi.org/10.1109/epeps.2018.8534203
https://doi.org/10.1109/epeps.2018.8534203
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:109-115
Capacitors play an important role in the analysis and design of power delivery networks for packages and printed circuit boards. Accurate characterization of multilayer ceramic capacitors is needed to understand product operation. A key aspect of mul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::327c1e39e8eeac3a4bbca43b99851b85
https://doi.org/10.1109/tadvp.2008.2004811
https://doi.org/10.1109/tadvp.2008.2004811
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
In today's high speed digital circuit design, some high data rate signal paths require interconnect simulations up to 100 GHz. One of the major challenges for these simulations is generating reliable and accurate frequency dependent material models f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87513c9e07a05d6bd9f53ae8af4fff1a
https://doi.org/10.1109/ectc.2015.7159637
https://doi.org/10.1109/ectc.2015.7159637
Autor:
Michael J. Hill, Leigh Wojewoda
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:714-718
In the analysis and design of electrical package and printed circuit board structures, engineers frequently rely on measured values of relative permittivity (epsivr). Typically, these measurements are performed using off-the-shelf instruments provide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5df7e4d5f6d51c7fc2160ccce5c529ad
https://doi.org/10.1109/tadvp.2006.879418
https://doi.org/10.1109/tadvp.2006.879418
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Intel® 4 th generation Core™ microprocessors are powered by high frequency integrated switching voltage regulators. The inductors required to implement these regulators were constructed using the routing layers of conventional organic flip chip pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74f881d60cd4f2fa2ac5be6a3e32623c
https://doi.org/10.1109/ectc.2014.6897335
https://doi.org/10.1109/ectc.2014.6897335
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
Discrete components, such as capacitors and inductors, play an important role in the analysis and design of electronic packages and printed circuit boards. Although the electrical parameters of discrete components are described by manufacturers, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c78b267c78e69cafe61169403d9c78dc
https://doi.org/10.1115/ipack2011-52268
https://doi.org/10.1115/ipack2011-52268