Zobrazeno 1 - 6
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pro vyhledávání: '"Lei, Baimao"'
Publikováno v:
In Heliyon 29 February 2024 10(4)
Autor:
Ye, Zhipeng, Zhu, Jiawei, Li, Qian, Mo, Bing, Lei, Baimao, Li, Yaqiu, Wang, Chunhui, Huang, Chuangmian
Publikováno v:
In Microelectronics Reliability September 2018 88-90:1151-1156
Autor:
Li Yaqiu, Mo Bing, Chunhui Wang, Ye Zhipeng, Lei Baimao, Chuangmian Huang, Zhu Jiawei, Li Qian
Publikováno v:
Microelectronics Reliability. :1151-1156
Process optimization problem of additive manufacturing nowadays is a research hotspot in the field of manufacturing industry. However, parameter uncertainty has not been considered in the past. In this paper, the process optimization methods of addit
Publikováno v:
2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).
Thermal performance evaluation test is a formal test work that must be carried out by enterprises of electronic products, it is also a key quality control link of products. This paper presents a test design method for evaluating the thermal performan
Autor:
Jiang, Chenyu1,2 (AUTHOR), Chen, Qiang1,2 (AUTHOR), Lei, Baimao1,2 (AUTHOR) leibaimao@126.com
Publikováno v:
Quality & Reliability Engineering International. Nov2024, p1. 20p. 13 Illustrations.
Publikováno v:
2018 12th International Conference on Reliability, Maintainability, and Safety (ICRMS).
Failure mechanisms are the root cause of product failure, and describes the internal physical and chemical process during a products' lifetime, reflecting the relationship between internal variables and product life under specific circumstances. By m