Zobrazeno 1 - 10
of 95
pro vyhledávání: '"Legtenberg, R."'
Publikováno v:
In Procedia CIRP 2013 9:55-60
Publikováno v:
In CIRP Journal of Manufacturing Science and Technology 2009 1(3):142-147
Akademický článek
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Autor:
Legtenberg, R., Legtenberg, Rob, Berenschot, Johan W., Elwenspoek, Michael Curt, Fluitman, J.H.J.
Publikováno v:
Journal of microelectromechanical systems, 6(3), 234-241. IEEE
A surface micromachining process is presented which has been used to fabricate electrostatic microactuators. These microactuators are interconnected with each other and linked to other movable microstructures by integrated gear linkages. The gear lin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b689d2594770128a24fed66ad0fc85c6
https://doi.org/10.1109/84.623112
https://doi.org/10.1109/84.623112
Autor:
Tas, Niels Roelof, Sonnenberg, A.H., Jansen, Henricus V., Legtenberg, R., Legtenberg, Rob, Elwenspoek, Michael Curt
Publikováno v:
Journal of micromechanics and microengineering, 6(4), 385-397. Institute of Physics (IOP)
Due to the smoothness of the surfaces in surface micromachining, large adhesion forces between fabricated structures and the substrate are encountered. Four major adhesion mechanisms have been analysed: capillary forces, hydrogen bridging, electrosta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e4498a1c98e1facfd983412d789d00d8
https://doi.org/10.1088/0960-1317/6/4/005
https://doi.org/10.1088/0960-1317/6/4/005
Autor:
Legtenberg, R., Legtenberg, Rob, Jansen, Henricus V., de Boer, Meint J., Elwenspoek, Michael Curt
Publikováno v:
Journal of the Electrochemical Society, 142(6), 2020-2028. The Electrochemical Society Inc.
Reactive ion etching of silicon in an RF parallel plate system, using SF6/O2/CHF3, plasmas has been studied. Etching behavior was found to be a function of loading, the cathode material, and the mask material. Good results with respect to reproducibi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5548cdb6e8f6b315e6a510085919c7d3
https://doi.org/10.1149/1.2044234
https://doi.org/10.1149/1.2044234
Autor:
Wits, W.W., Legtenberg, R., Mannak, J.H., Stoffels, G.G.M., van der Meer, T.H., van Steenhoven, A.A.
Publikováno v:
Proceedings 5th European Thermal-Sciences Conference (Eurotherm 2008)
Heat pipes are increasingly used to manage heat dissipations in electronic products. In a novel design approach for these products, a flat miniature heat pipe has been integrated inside the laminated structure of a printed circuit board (PCB). The ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::4b44a0aecfb7f094f151a902af5535bf
https://research.utwente.nl/en/publications/selecting-capillary-structures-for-heat-pipes-in-multilayer-printed-circuit-boards(e96332d6-f593-4053-b506-61eea7563287).html
https://research.utwente.nl/en/publications/selecting-capillary-structures-for-heat-pipes-in-multilayer-printed-circuit-boards(e96332d6-f593-4053-b506-61eea7563287).html
Autor:
Wits, Wessel Willems, Brok, G.J.H.M., Mannak, J.H., Legtenberg, R., van Houten, F.J.A.M., Miedema, J., Lutters, D.
Publikováno v:
CIRP Design Conference 2008
This publication discusses domain integration of various engineering disciplines as an effective methodology to design new and innovative products. A case study illustrates how this approach is applied to the design process of a high performance elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::7540cb2a4371b6d7106082e3f13456ea
https://research.utwente.nl/en/publications/novel-cooling-strategy-for-electronic-packages-directly-injected-cooling(7dc4a347-7046-47e9-8d3b-3dfecc3362c2).html
https://research.utwente.nl/en/publications/novel-cooling-strategy-for-electronic-packages-directly-injected-cooling(7dc4a347-7046-47e9-8d3b-3dfecc3362c2).html